2019 IEEE 2nd International Conference on Electronic Information and Communication Technology (ICEICT 2019) will be held in Harbin, China on January 20-22, 2019. 

ICEICT 2019 is sponsored by Harbin Engineering University, IEEE Harbin Section and IEEE Harbin AP/MTT/EMC Joint Chapter, it is also supported by other research institutes and local universities. 

It is the second forum to provide a platform for bringing together researchers, practitioners, and academia to present and discuss ideas, challenges and potential solutions on established or emerging topics related to research and practice in computer science, information technology and communication systems. The first forum ICEICT was successfully inaugurated by Harbin Institute of Technology in Harbin in 2016. All accepted papers of ICEICT 2016 has been indexed by EI Compendex. 

Following the ICEICT 2016, the proceedings of ICEICT 2019 that meet IEEE quality review standards will be eligible for inclusion in the IEEE Xplore Digital after the review taken by IEEE conference publication group and then submitted to EI Compendex index.

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Important Dates

Draft paper submission deadline:2018-12-01

Draft paper acceptance notification:2018-12-15

Final paper submission deadline:2018-12-30

Author guidelines

Please be noted: All original papers will be submit to IEEE Crosscheck System to check the Multiple Publication and Plagiarism problems, please prepare your paper carefully before submission.

Topics of submission

I. Communications and Network
Modeling & Simulation of Communication Systems
Network Architecture & Protocol
Optical Fiber/Microwave Communication
Wired & Wireless Communication and Networking
IoT (Internet of things); RFID; WPAN; ZigBee
Modulation, Coding and Information Theory
Satellite Communications; Ultra-Wideband; Protocols; Nano networks
Optical Communications and Networking; Mobile Computing
Grid, cluster and P2P computing; Pervasive/ubiquitous computing
Web services and Internet computing; Computer and Network Security
Cryptography; Mobile and Wireless networks security
Optical network security
Web, eBusiness, eCommerce, eGovernment security

II. Signal Processing (SP) and Information Technology

Acoustic/Sonar Imaging and Techniques
Biomedical Image Processing
Radar SP and Imaging, SAR, ATR 
MIMO SP for Radar
Ground and Foliage Penetration Systems
Signal Acquisition and Sensor Management
DF, Emitter Location, Elint, Array Processing 
Target Detection, Identification and Tracking 
Data Fusion; Information Storage;

Trusted Computing and Fault-Tolerant Computing
Operating System; Software Engineering; Information Security
Sensor data processing, mining, and machine learning

Coding, compression and information theory

III. Antennas, Propagation, and Scattering

Smart Antennas, Beamforming and MIMO

Wave Propagation and Channel Modeling

Wave Scattering and RCS

NanoEM, Plasmonics, and Applications

Metamaterials, FSS and EBG

EM Field Theory and Numerical Techniques

EM Interference & Compatibility, SI

Spectrum Management and Monitoring

RF, uWave, mmW and THz Measurements

IV. Microwave Systems, Radar, RF

Aeronautical and Space Applications

RFID Devices/Systems/Applications

Automotive/Transportation Radar & Communications

UWB and Multispectral Technologies & Systems

Emerging System Architectures

Modelling Techniques for RF Systems

Radar Techniques, Systems and Applications

Sonar Systems and Applications

Wireless Power Transfer & Energy Harvesting

Terahertz Systems

Instrumentation and Measurement Techniques

Linear Device Modeling

Nonlinear Device Modeling

Terahertz Devices: Electronics/Photonics/Plasmonics

(MIMO) measurements

Nonlinear measurement techniques

RF packaging and package modeling

Semiconductor devices and component modeling for RF applications

RF MEMS and microsystems

Microwave and millimeter-wave systems

Radar, SAR and microwave imaging

Electronic warfare and other military applications of RF/microwaves

Measurement techniques for antennas, electromagnetic radiation, propagation

Novel electromagnetic materials


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Sponsored By

  • Harbin Engineering University
    IEEE Harbin Section