Description

SMTA and Chip Scale Review are pleased to announce the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

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Contact information

  • tanya@smta.org

Sponsored By

  • IEEE Electronics Packaging Society
    Surface Mount Technology Association (SMTA)