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Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
ID：153 View Protection：ATTENDEE Updated Time：2021-08-30 13:38:02 Hits：349 Tutorial

Start Time：2021-08-25 17:00（Asia/Shanghai）

Duration：60min

Session：T1 Tutorial Session 1 » T1Tutorial Session 1

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Abstract
Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues
Keywords
Speaker
Nan Jiang
Hefei Comprehensive National Science Center

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Important Date

  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology
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