Thermal Design and Optimization of SiC Power Module
ID:155 View Protection:ATTENDEE Updated Time:2021-08-30 13:58:30 Hits:589 Tutorial

Start Time:2021-08-25 14:30(Asia/Shanghai)

Duration:60min

Session:T2 Tutorial Session 2 » T2Tutorial Session 2

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Abstract
Thermal Design and Optimization of SiC Power Module
Keywords
Speaker
Zhiqiang Wang
Huazhong University of Science and Technology

Tong Wu
ON Semiconductor

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Important Date
  • Conference Date

    Aug 25

    2021

    to

    Aug 27

    2021

  • Apr 21 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 25 2021

    Final Paper Deadline

  • Aug 24 2021

    Contribution Submission Deadline

Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology