Presentation List
My Presentations
Analysis of the influence of vibration and thermal vibration coupling on the power module
JiaJia Guan Huazhong University of Science and Technology
Room1 /S1&S2
2021-08-27 10:00 ~ 10:15
ATTENDEE Oral Presentation
Improved Breakdown Characteristics for AlN/GaN/InGaN Coupling Channel HEMTs with SiNx Removal and Backfill Technique
Hao Lu School of Microelectronics； Xidian University
Room2 /S5&S6
2021-08-27 08:45 ~ 09:00
ATTENDEE Oral Presentation
Analysis of GaN HEMT Degradation under RF Overdrive Stress
YiQiang Chen The No.5 Electronics Research Institute of the Ministry of Industry and Information Technology；YuHan Xie South China University of Technology
Room1 /S1&S2
2021-08-27 09:45 ~ 10:00
ATTENDEE Oral Presentation
Soft-Switching Resonant Active Clamp Flyback based-on GaN HEMTs for MHz High Step-Up Applications
Wuji Meng Nanjing University of Aeronautics and Astronautics
Room2 /S7&S8
2021-08-27 14:00 ~ 14:15
ATTENDEE Oral Presentation
Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode
Zhanwei Shen Chinese Academy of Sciences；Institute of Semiconductors
Room2
PUBLIC Poster Presentation
Impacts of Power Level on Parasitic Capacitance in Copper-Foiled Medium-Voltage Inductors
Hongbo Zhao Aalborg University
Room1
ATTENDEE Oral Presentation
Characteristics of SiC MOSFET in a Wide Temperature Range
Mengyu Zhu Xi'an Jiaotong University
Room1 /S1&S2
2021-08-27 10:45 ~ 11:00
ATTENDEE Oral Presentation
Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures
Yifan Zhang Huazhong University of Science and Technology
Room1 /S3&S4
2021-08-27 15:30 ~ 15:45
ATTENDEE Oral Presentation
Design and fabrication of low pinch-off voltage 700V lateral 4H-SiC MESFET with thin RESURF layer
Atsushi Shimbori Research Assistant University of Texas at Austin
Room2
ATTENDEE Oral Presentation
A Single-Stage Modular DCX with High Voltage Conversion Ratio Based on High Frequency LLC Resonant Converter
Wen Zhaoliang student Harbin Institute of Technology
Room2 /S7&S8
2021-08-27 14:30 ~ 14:45
ATTENDEE Oral Presentation
Important Date
-
Conference Date
Aug 25
2021
toAug 27
2021
-
Apr 21 2021
Abstract Submission Deadline
-
May 15 2021
Abstract Notification of Acceptance
-
Jun 25 2021
Final Paper Deadline
-
Aug 24 2021
Contribution Submission Deadline
Sponsored By
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE ELECTRONIC DEVICE SOCIETY
Organized By
Huazhong University of Science and Technology
Contact Information
Previous Conferences
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2023-08-27 Taiwan, China Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) -
2018-05-17 China xian
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia(WiPDA Asia 2018)
