logo

Choose your Country/Region

Asia
China
India
Japan
South Korea
Malaysia
Taiwan, China
United Arab Emirates
Indonesia
Hong Kong, China
Singapore
Thailand
Turkey
America
United States
Canada
Brazil
Argentina
Mexico
Colombia
Chile
Peru
Guatemala
Europe
Italy
United Kingdom
France
Germany
Spain
Portugal
Austria
Poland
Greece
Russian Federation
Czech Republic
Switzerland
Netherlands
Sweden
Romania
Hungary
Belgium
Ukraine
Ireland
Croatia
Finland
Denmark
Cyprus
Serbia
Slovakia
Norway
Bulgaria
Iceland
Oceania
Australia
New Zealand
Fiji
Africa
South Africa
Tunisia
Morocco
Egypt
  • Product
    • Software
    • Webinar
    • Video conference
    • Virtual conference
    • Institution Edition
  • Discover
    • Subject category
    • Conference in United States
    • Contribution library
    • Browse by venue
  • Services

Lecture

Meeting/Workshop/Tutorials

Conference

Log in Sign up

2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME 2022)

Oct. 26 - 29, 2022

Bucharest · Romania

Conference Virtual Conference
0 Views
0 Comments
Favorite
Share
Photos
No Photos
  • Home
  • Program
  • Timetable
  • Photo
  • Management
Important Date
  • Conference Date

    Oct 26

    2022

    to

    Oct 29

    2022

Sponsored By
Hungary/Romania Section EP/NANO Jt. Chapter
Contact Information
  • Delia Lepădatu
  • si******@cetti.ro
  • 004*********
Login to view full contact details
Previous Conferences
  • 2021-10-27

    2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging
  • 2018-10-25 Romania

    2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging
  • 2017-10-26 Romania

    2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging
  • 2016-10-20 Romania Oradea, Romania

    2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging
  • 2014-10-23 Romania

    2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging
  • 2013-10-24 Romania

    2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
Contact Information

About Us | News | Blog | Feedback | Disclaimer | Privacy Policy | Terms of Service | Contact

Copyright © 2013-2021  Aconf.org - One-stop solutions for academic events

鄂ICP备09016152号-4