Description

The premier international packaging, components, and microelectronics systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year’s conference will have about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. The 63rd ECTC will be held at the Cosmopolitan of Las Vegas, Las Vegas, Nevada, USA from May 28 - May 31, 2013. The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards. The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies. The Panel Discussion, Plenary Session, and CPMT Seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders. The Technology Corner complements the Technical Program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.

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Contact information

  • Patrick Thompson
  • patrick.thompson@ti.com
  • +1 518 222 6128

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