Description

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

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Contact information

  • Tom Reynolds
  • t.reynolds@ieee.org
  • 18508977323

Sponsored By

  • IEEE