The 15th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

374 / 2019-01-21 11:26:26

A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC

three-dimensional integrated circuits (3D IC),,thermal through-silicon via (TTSV),redistribution layer (RDL),heat-dissipation

Plenary track > Nanoelectronics

Three-dimensional integrated circuits (3D IC) is the product of the development of integrated circuit industry. Multilayer silicon chip stack brings about the problem of too high temperature and too large temperature gradient. Thermal through-silicon via (TTSV) structure can transfer most of the heat to heat sink, but it does not solve the problem of local overheating on the silicon wafer. In this paper, The heat dissipation system composed of redistribution layer (RDL) and TTSV proposed can rapidly reduce the hot spot temperature.