The 15th IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

573 / 2019-03-15 10:38:48

A Study on Novel Integrated Base Plate (IBP) Package for Power Electronics Module

integrated base plate,IGBT,thermal cycling,finite element model,power module package,thermal analysis

Plenary track > Power Electronics

DBC substrates and thick copper base plate are commonly used in power module packages. Due to CTE mismatch of various packaging materials, stress and warpage would generate inner module and lead to crack, delamination or fatigue failure. This paper proposes the integrated base plate (IBP) package for power electronics module, and studies its thermal performance and thermal cycling reliability by both experimental and finite element methods. The comparison of temperature distribution between traditional and IBP module during the operation has been presented, and demonstrates the improvement of thermal performance of IBP package. The thermal cycling test results also show that no failure after 500 thermal cycles, which reveal the reliability advantage compared with traditional DBC package.