Effect of void diameter on the mode-I fracture characteristics and crack propagation behavior of basalt
ID:76 View Protection:ATTENDEE Updated Time:2026-07-30 17:37:17 Hits:11 Oral Presentation

Start Time:2026-08-11 17:10(Asia/Hong_Kong)

Duration:15min

Session:S13 Session 13 Physical Modelling for Geo-disaster Reduction » S13Session 13 Day 3

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Abstract
To reveal the effect of void diameter on the mode-I fracture behavior of basalt, notched semi-circular bend (NSCB) specimens containing pre-existing circular voids with different diameters were tested under three-point bending. Digital image correlation (DIC) was used to monitor crack propagation and characterize fracture toughness, strain localization, crack propagation rate, and fracture process zone (FPZ) evolution. The results show that the peak load and mode-I fracture toughness decrease progressively with increasing void diameter. Compared with the void-free specimen, the average fracture toughness of specimens with void diameters of 2, 4, and 6 mm decreases by 33.75%, 42.57%, and 54.76%, respectively. The crack propagation process can be divided into elastic deformation, microcrack incubation and nucleation, and main crack propagation and coalescence. A larger void diameter shortens the elastic stage and enhances strain concentration at the crack tip. The crack propagation rate increases with void diameter before crack–void coalescence and rises sharply after coalescence, especially in specimens with larger voids. The fully developed FPZ length predicted by the Dugdale–Barenblatt model agrees well with the experimental results, while the FPZ width is more sensitive to void diameter.
Keywords
Rock mechanics,Fracture process zone,Crack propagation rate,fracture toughness,void
Speaker
Lexin CHEN
Tongji University

Submission Author
Lexin Chen Tongji University
Deheng Kong Tongji University
Bo Li Tongji University
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Important Date
  • Conference Date

    Aug 09

    2026

    to

    Aug 13

    2026

  • Aug 06 2026

    Draft paper submission deadline

  • Aug 12 2026

    Registration deadline

Sponsored By
The Hong Kong Polytechnic University
Organized By
International Consortium on Geo-disaster Reduction (ICGdR)
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