2017中美创新峰会 -“人工智能链接未来”

In order to continue to build a platform for transnational technological innovation and to promote resource sharing in the technology sector, China American Innovation Network and the Shanghai Lingang Group will jointly hold annual summit on "Artificial Intelligence – Linking the Future" in Shanghai, China in July 2017. In recent years, the discussion and practice of artificial intelligence is climbing. Meeting the needs for modern times, artificial intelligence is in the intersection of machine learning, big data, cloud computing, mobile Internet, Internet of things and other emerging business model, as well as the inevitable direction of the evolution of modern civilization. We will focus on the hottest technical and commercial issues, “smart” concept and technology in all areas of important applications.