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Introduction

The 1st National Conference on Insulating Materials & Packaging Technologies(IMPT2017)will be held on October 28-29, 2017 in Tianjin University, China. On behalf of the organizing committee and ourselves, we sincerely expect for your participation. The focus of this conference includes all aspects about insulating materials, insulating technologies, packaging technologies, reliability analysis, packaging failure analysis and assessments and other related fields. Tianjin is usually reputed as "BoHai Pearl" which is certainly recognized as the ideal venue for this event. We cordially welcome you to Tianjin, China.

Committee

General Chair 

Prof. Robin HONG: Associate Professor, Tianjin University
Program Chair 
Prof. Ping CHEN: Professor, Dalian University of Technology
Prof. Lihuan REN: Professor, Tianjin University
Program Committee 
Prof. Lianhong ZHANG: Professor, Tianjin University
Prof. Junwei TAO: Professor, Tianjin University
Prof. Xiaojian HE: Professor, China Academy of Engineering Physics
Prof. Gang WANG: Professor, Institute of Electronics, Chinese Academy of Sciences
Prof. Lei WU: Professor, Tianjin Research Institute of Physical and Chemical Engineering of Nuclear Industry
Prof. Yi YU: Professor, Tianjin Synthetic Material Research Institute
Prof. Hong CHEN: Associate Professor, Editorial department
Prof. Wei ZENG: Associate Professor, Tianjin University of Science and Technology
Prof. Zhihong LI: Associate Professor, Tianjin University
Prof. Xiaochuan ZHANG: Associate Professor, Tianjin University of Commerce
Prof. Dawei ZHANG: Professor, Tianjin University
Prof. Yangjun LEI: Professor, China Academy of Engineering Physics
Prof. Kang PENG: Associate Professor, China Academy of Engineering Physics
Prof. Lin ZOU: Associate Professor, Editorial department
Prof. Hong JIANG: Professor, Hohai University

Call for paper

Important date

2017-08-31
Draft paper submission deadline

论文投稿

1. 投稿方式:点击立即投稿

2. 格式和模板:所有参赛作品必须是英语且论文不得超过长8页,作者可以参考模板来准备论文

3. 政策:提交的论文以前不得在任何地方发布过,不得在IMPT2017审查过程之前和期间将论文提交任何其他会议。向会议提交论文意味着如果论文被接受,至少有一位作者将为提交的论文注册并参加会议。

Submission Topics

Topics of interest for submission include, but are not limited to:
1.Insulating Materials & Insulating Technologies

  • Advanced insulating materials
  • Insulating material synthesis technologies
  • Insulating material applications
  • Plastic molding materials
  • Material insulating theories
  • Insulating property testing and analysis
  • Electrical insulating technologies
  • High-voltage insulating technologies

2.Packaging Technologies & Techniques

  • Advanced packaging technologies and techniques
  • New packaging materials
  • Packaging performance testing
  • Semiconductor packaging
  • LED packaging
  • MEMS packaging
  • Power device packaging
  • System packaging and assembly technologies
  • Advanced molding technologies

3.Reliability Research & Analysis

  • Insulating packaging reliability
  • Component reliability
  • Reliability theories and analysis
  • Environmental reliability analysis
  • Acceleration testing technologies
  • Reliability testing and evaluation
  • New reliability analysis techniques

4.Packaging Failure Analysis & Assessments

  • Packaging failure analysis
  • Packaging failure mechanism
  • Packaging failure testing and assessments
  • New failure diagnose and prediction techniques
  • Non-destructive testing methods

Guidlines

1.At least one author of each accepted paper must register using the author registration rate to ensure that the paper is included in the conference proceedings. The author registration must be received before and by the specified author registration deadline, i.e., August 31, 2017.
2.Payment of the registration fee covers the cost of proceedings publishing, flight shipping, custom taxes, conference venue and session rooms renting, coffee/ tea breaks, conference banquet, and all lunches and dinners during the conference. Notice that the registration fee does not cover travelling fee and hotel fee.
3.Please write your name and paper ID (if you have a paper) on the bank transfer receipt (from the bank), and e-mail the scanned copy of your receipt to impt2017@yeah.net .
4.Payments sent by bank transfer must be free of charges for IMPT2017 and only the bank transfer is accepted for author registration.
5.There is no double discount for student member and post-doctor (Post-doctor is not considered as a student).
6.If the same author has more than one paper accepted by the conference, each paper is required for registration separately.
7.An official receipt for the payment will be passed to the registrant at the conference site. 

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Important Date
  • Conference Date

    Oct 28

    2017

    to

    Oct 29

    2017

  • Aug 31 2017

    Draft paper submission deadline

  • Oct 29 2017

    Registration deadline

Sponsored By
天津大学
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