Introduction

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

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Important Date
  • Conference Date

    Jun 16

    2020

    to

    Jun 18

    2020

  • Jun 18 2020

    Registration deadline

Sponsored By
IEEE Electron Devices Society
IEEE Solid-State Circuits Society
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