Description

New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing of VLSI devices including 3D - system integration - Processes and devices modeling of VLSI devices - Reliability related to the above devices.

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Contact information

  • Phyllis Mahoney
  • phyllism@widerkehr.com

Sponsored By

  • IEEE Electron Devices Society
    IEEE Solid-State Circuits Society

Organized By

  • Japan Society of Applied Physics - JSAP