The 20th International Conference on Electronics Materials and Packaging (EMAP 2018) will be held in Hong Kong, a gateway between the East and West. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. The EMAP 2018 committees are cordially invite researchers, engineers, scientists and professors and students to submit an abstract and join EMAP 2018. From the successful stories of previous EMAP in Japan, Korea, Malaysia Singapore, and Taiwan, this annual event is a great opportunity to group people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentation from world-renowned speakers, sharing sessions and technical short courses. Excursion will be arranged to show you the natural side of Hong Kong. Come and join us and see you in EMAP 2018.
Abstract Submission Deadline
Draft Paper Acceptance Notification
Draft paper submission deadline
Final Paper Deadline