Introduction

The 20th International Conference on Electronics Materials and Packaging (EMAP 2018) will be held in Hong Kong, a gateway between the East and West. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. The EMAP 2018 committees are cordially invite researchers, engineers, scientists and professors and students to submit an abstract and join EMAP 2018. From the successful stories of previous EMAP in Japan, Korea, Malaysia Singapore, and Taiwan, this annual event is a great opportunity to group people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentation from world-renowned speakers, sharing sessions and technical short courses. Excursion will be arranged to show you the natural side of Hong Kong. Come and join us and see you in EMAP 2018.

Call for paper

Important date

2018-07-31
Abstract submission deadline
2018-11-15
Draft paper submission deadline
2018-08-31
Draft paper acceptance notification
2018-11-15
Final paper submission deadline

Topics:

  • Additive Manufacturing
  • Advanced Packaging
  • Emerging Technologies
  • High Density and 3D Packaging
  • Materials and Processing
  • MEMS Packaging and Applications
  • Modeling and Simulation
  • Optoelectronics and Photonics
  • Quality and Reliability Assessment
  • Thermal Management
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Important Date
  • Conference Date

    Dec 17

    2018

    to

    Dec 20

    2018

  • Jul 31 2018

    Abstract Submission Deadline

  • Aug 31 2018

    Draft Paper Acceptance Notification

  • Nov 15 2018

    Draft paper submission deadline

  • Nov 15 2018

    Final Paper Deadline

Supported By
Hong Kong University of Science and Technology
Contact Information
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