It is my pleasure to invite you to join the 2018 Symposium on VLSI Technology on behalf of all my colleagues in the organizing committee. The Symposium will be held from June 18th to June 21st at the Hilton Hawaiian Village in Honolulu, Hawaii, USA.For more than three decades, Symposium on VLSI Technology has been one of the world’s premier technical conferences on semiconductor technology and microelectronics for bringing together the best and brightest minds to share creative innovations and path breaking discoveries that pave the future of this field.In 2018, we will have fully overlapped program with the Symposium on VLSI Circuits at the same location and participants can attend both Technology and Circuits sessions. The symposium programs are designed to provide the topics both from technology and circuit design aspects, which will be presented by the experts from industry and academia. Joint Focus Sessions, Joint Evening Panel Discussion and Joint Banquet will be planned to stimulate the discussion and networking between technology and circuits design community.The conference will start on June 18th with a day-long technology short course lectures delivered by well-known experts from industry and academia on topics of highest interest to the VLSI community. The Circuits short course will be offered on the same day as part of fully overlapped program.I hope to see you at the 2018 Symposium on VLSI Technology, and also hope that you will encourage your colleagues and peers to contribute papers and join the Symposia. I look forward to welcoming you to lovely Hawaii in June 2018.

Call for paper

Papers will be selected based on technical merit, advances relative to previously published work, credibility of claims, and quality of writing and illustrations. The scope includes: IoT, AR/VR and AI Technologies including CPU, GPU, ultra-low power technologies; in-memory computing, heterogeneous, 3D and 2.5D integration; wearable devices sensors, display, connectivity; power management; digital/analog, micro-controllers and application processors Stand-Alone and Embedded Memories technology and reliability for SRAM, DRAM, 3D NAND and NOR Flash, MRAM, PCRAM, ReRAM, FeRAM and other New Memories CMOS Technology, Microprocessors and SoCs including scaling, VLSI manufacturing concepts, and yield optimization RF / Analog / Digital Technologies and Sensors for mixedsignal SoC; RF front end; analog, mixed-signal, I/O, high-voltage, imaging, MEMS, integrated sensors Process and Materials Technologies including device process and architecture, modeling and reliability; high mobility channels; advanced lithography, high-density patterning; SOI and III-V technologies; processes for high-aspect ratio in 3D NAND and advanced BEOL integration Packaging Technologies and System-in-Package (SiP) including through-silicon-vias (TSVs) and 3D-system integration Photonics Technology and Beyond CMOS Devices for energy efficient electronics and new computation paradigms, 1D and 2D materials, spintronics and their integration on CMOS

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Important Date
  • Conference Date

    Jun 18



    Jun 22