The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading event.
EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.
Pisa where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit in Italy.
See you in Pisa!
Call for paper
Draft paper submission deadline：2019-01-15
Call for paper description
- ADVANCED PACKAGING
Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, CoB, SiP, SoC, Systems-Integration Technologies, Embedded Passives on Wafers and Substrates, High Frequency and High Power Packaging, LTCC Technologies, Micro-Vias and Build-Up Technologies, Lab-on-Chip, Lab-on-Substrate, Molecular Electronics.
- SUBSTRATE TECHNOLOGIES
Inorganics, Organics, Co-fired, Flexibles, HD PCBs, Laminates, Printed, Microfluidics, Substrates Design and Technologies.
- INTERCONNECTION TECHNOLOGIES
Thick and Thin Film Technologies, Wire Bonding, Bumping, Flip Chip Bonding, Cu/Low-k Wafers, Through Silicon Vias, Advances in Soldering, Adhesive Joining, Connectors.
- MORE THAN MOORE
The future of IC shrinkage, the future options for IC packaging.
MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS, Bio-MEMS, WiFi modules.
Silicon Photonics, Power LED Assembly, Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fibre Optic Communication, LiFi modules.
- SOLAR ENERGY & PHOTOVOLTAICS
Packaging Design to improve Efficiency of Photovoltaic modules, Reliability and Qualification Approaches.
- NANO TECHNOLOGIES
Smart Materials, Interconnections, Nano-Scale Packaging: Applications and Reliability.
- GREEN ELECTRONICS
Recovery and Recycling, Base material technologies.
- MEDICAL ELECTRONICS
Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements.
- POWER ELECTRONICS
Application in Consumer, Telecom, Automotive, Wearable, Space and Defence, Fuel Cells, Battery Technologies.
- SMART TEXTILES
Wearables, Materials, Technologies, Applications, Markets, Reliability.
- MANUFACTURING TECHNOLOGIES AND MATERIALS
Process Development, New Equipment, Clean Room Technologies, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing, Micromachining, Dispensing, Printing, Deposition, Adhesives, Encapsulants, Underfills, Moulding Compounds, Advanced Solder Alloys, Halogen Free Materials, Dielectrics, Ceramics.
Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection and Packaging Technologies, Thermal Characterisation and Cooling Solutions, Modelling and Simulation Methodology for Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques, Mechanical Modelling and Structural Integrity, Thermo-Mechanical Stress Analysis, Vibration and Shock Tests.
- THERMAL MANAGEMENT
Techniques, Heatsinks, Heat pumping.
- RELIABILITY and QUALITY
Specialised topics, Components, Counterfeits, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion, Accelerated Testing, Reliability Engineering, Inspection and Test, Obsolescence Engineering, Prognostics.
Ambient Intelligence methods and products, Circuits and Systems, Touch Screen technologies.
Medical, Bio-Tec, Telecoms, Mobile, Smart Phones, RFID, Automotive, Aerospace, Robotics, Consumer, Structural
- BUSINESS ASPECTS
Electronics and Photonics, In-house or Outsource?, Markets, Supply Chain, Distribution, Microelectronics packaging and assembly industry