Third International conference on Electronics, Communication and Aerospace Technology (ICECA 2019) is being organized on 12-14, June 2019 by RVS Technical Campus.ICECA 2019 will provide an outstanding international forum for scientists from all over the world to share ideas and achievements in the theory and practice of all areas of aero space technologies. Presentations should highlight inventive systems as a concept that combines theoretical research and applications in Electronics, Communication, Information and Aerospace technologies.


Submission Date
10, April 2019

Notification of Acceptance
10, May 2019

Last date of registration
25, May 2019

Conference Date
12-14, June 2019

Call for paper

Important Dates

Draft paper submission deadline:2019-01-10

Topics of submission

Original and high quality research papers are solicited in all areas of Electronics, Communication and Aerospace Systems. We seek research full papers and posters on a broad range of topics, including but not limited to:

Coding Techniques for 3G & 4G
UWB Systems
Digital Multimedia Systems
Airborne Vehicle Communication
Antenna Systems
Signal & Image Processing
Telemetry & Tele command Systems
Optical Communication
Satellite Technology
Earth Station Systems & Technology
Wireless Networks
Spectrum Management
Cognitive Radio Design
Millimeter Wave Technology
Telecom Management
Underwater Communication
Biomedical Signal Processing
Wavelets & Applications
Multi Carrier Modulation
MIMO Systems
Microwave Systems
Electromagnetics Engineering
Bio-computation Techniques
Big Data
Cloud Computing
Health care Informatics

Data Communication and Computer Networking
High Speed Networks
Mobile Computing
Mobile Networks & Wireless LAN
Optical Networking
Network Based Applications
Network Security
Next Generation Web
Recent Trends in Computer Networks
Wireless and Adhoc Network
Wireless Multimedia systems

Aerospace Technologies
Aerospace electronics
Power systems
Electric/electronic components and distributors
Electric systems
Propulsion systems
Safety systems
Space systems
Unmanned aerial vehicle systems

Electronics Technologies
3D Process and Integration Technologies
Substrate Embedding & Advanced Flip-Chip Packaging
MEMS & Sensor Technologies
Wafer-Level CSP & Heterogeneous Integration
Design and Analysis of Power Delivery Systems
Novel Materials, Devices and 3D Interconnects
Wearable, Flexible, and Stretchable Electronics
Optical Interconnects & 3D Photonics
Digital System and Logic Design
Computer Architecture and VLSI
Networked-Driven Multicore Chips
Advance Robotics systems
Electrical Machines
Analog and Digital Electronics
Signals and Systems

Communication technologies
Wireless Networks
MIMO Systems
Microwave Engineering
Wireless Security
Computer networks
IOT and Cloud Computing
Artificial Intelligence / Semantic Web & Ontology
Grid Computing / Cloud Computing
High Performance Computing & Networks
Fuzzy Systems & Soft Computing
Computational methods, Algorithms & Scientific Applications


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Sponsored By

  • IEEE Madras Section AES Chapter
    RVS Technical Campus