Description

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to invite you to Gdynia.

The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.
The MIXDES conference papers are indexed in INSPECWeb of Science and available in IEEE Xplore.

The topics of the MIXDES  Conference include:

  1. Design of Integrated Circuits and Microsystems
    Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
  2. Thermal Issues in Microelectronics
    Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
  3. Analysis and Modelling of ICs and Microsystems
    Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
  4. Microelectronics Technology and Packaging
    New microelectronic technologies. Packaging. Sensors and actuators.
  5. Testing and Reliability
    Design for testability and manufacturability. Measurement instruments and techniques.
  6. Power Electronics
    Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
  7. Signal Processing
    Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
  8. Embedded Systems
    Design, verification and applications.
  9. Medical Applications
    Medical and biotechnology applications. Thermography in medicine.

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Registration

Standard registration fee(Non-Authors)

Conference fee includes: participation in all sessions, MIXDES 2019 Proceedings CD and other conference materials, coffee and tea during the breaks, all lunches, the Welcome Party and Conference Banquet, tourist activities (student fee does not include welcome party and closing ceremony). Conference fee does not include accommodation and transport.

IEEE Members registration fee(Non-Authors)

Conference fee includes: participation in all sessions, MIXDES 2019 Proceedings CD and other conference materials, coffee and tea during the breaks, all lunches, the Welcome Party and Conference Banquet, tourist activities (student fee does not include welcome party and closing ceremony). Conference fee does not include accommodation and transport.

Student registration fee(Non-Authors)

Conference fee includes: participation in all sessions, MIXDES 2019 Proceedings CD and other conference materials, coffee and tea during the breaks, all lunches, the Welcome Party and Conference Banquet, tourist activities (student fee does not include welcome party and closing ceremony). Conference fee does not include accommodation and transport.

Late registration fee (Non-Authors)

(paid after May 15 , 2019)Conference fee includes: participation in all sessions, MIXDES 2019 Proceedings CD and other conference materials, coffee and tea during the breaks, all lunches, the Welcome Party and Conference Banquet, tourist activities (student fee does not include welcome party and closing ceremony). Conference fee does not include accommodation and transport.

Accompanying person social events fee(Non-Authors)

Conference fee includes: participation in all sessions, MIXDES 2019 Proceedings CD and other conference materials, coffee and tea during the breaks, all lunches, the Welcome Party and Conference Banquet, tourist activities (student fee does not include welcome party and closing ceremony). Conference fee does not include accommodation and transport.

Call for paperSubmit paper

Important Dates

Draft paper submission deadline:2019-02-28

Draft paper acceptance notification:2019-04-30

Final paper submission deadline:2019-05-15

Call for paper description

A call is made for papers, contributions and other conference activities on the topics mentioned above.
Full papers should be submitted till February 28 , 2019 - only in electronic form (MS Word, RTF, Open Office Writer, LaTeX, together with a generated PDF file).
The paper submission form and required format is available on our Web page. Authors are asked to indicate the topic into which their papers fall. The papers will be reviewed by at least two referees from the International Programme Committee. The papers will be published in the proceedings from the author's electronic submission.

Committee

  • International Programme Committee

Prof. M. Bucher Technical University of Crete, Greece
Prof. J. Cabestany Universitat Politecnica de Catalunya, Spain
Prof. J. Collet LAAS - CNRS, Toulouse, France
Prof. A. Dąbrowski Poznan University of Technology, Poland
Prof. G. De Mey University of Ghent, Belgium
(Vice-Chairman)
Prof. J. Deen McMaster University, Canada
Prof. M.H. Fino Universidade Nova de Lisboa, Portugal
Dr. D. Foty Gilgamesh Associates, USA
Prof. L. Golonka Wrocław University of Technology, Poland
Prof. K. Górecki Gdynia Maritime University, Poland
Dr. W. Grabiński GMC, Switzerland
Prof. P. Gryboś AGH University of Science and Technology, Poland
Prof. V. Hahanov Kharkiv National Univ. of Radioelectronics, Ukraine
Prof. A. Handkiewicz Poznan University of Technology, Poland
Prof. A. Hatzopoulos Aristotle University of Thessaloniki, Greece
Dr. S. Hausman Technical University of Lodz, Poland
Dr. G. Jabłoński Lodz University of Technology, Poland
Prof. A. Jakubowski Warsaw University of Technology, Poland
Prof. A. Kos AGH University of Science and Technology, Poland
Prof. W. Kuźmicz Warsaw University of Technology, Poland
(Programme Chairman)
Prof. C. Lallement Strasbourg University, France
Prof. M. Lobur Lviv Polytechnical National University, Ukraine
Dr. M.M. Louerat Université Pierre et Marie Curie, Paris, France
Prof. T. Łuba Warsaw University of Technology, Poland
Prof. B. Macukow Warsaw University of Technology, Poland
Prof. J. Madrenas Universitat Politecnica de Catalunya, Spain
Prof. A. Martinez LAAS - CNRS, Toulouse, France
(Honorary Chairman)

Prof. A. Materka Technical University of Lodz, Poland
Prof. W. Mathis University of Magdeburg, Germany
Prof. J.M. Moreno Universitat Politecnica de Catalunya, Spain
Dr. M. Napieralska Technical University of Lodz, Poland
Prof. A. Napieralski Technical University of Lodz, Poland
(General Chairman)
Prof. J. Nishizawa Semiconductor Research Institute, Japan
Dr. J.L. Noullet INSA de Toulouse, France
Prof. L. Opalski Warsaw University of Technology, Poland
Prof. A. Pfitzner Warsaw University of Technology, Poland
Prof. E. Piętka Silesian University of Technology, Poland
Prof. W. Pleskacz Warsaw University of Technology, Poland
Dr. B.F. Romanowicz Nano Science and Technology Institute, USA
Prof. J.A. Rubio Universitat Politecnica de Catalunya, Spain
Prof. J. Rutkowski Silesian University of Technology, Poland
Prof. A. Rybarczyk Poznan University of Technology, Poland
Dr. J.-M. Sallese Swiss Federal Institute of Technology, Switzerland
Prof. D. Sankowski Technical University of Lodz, Poland
Dr. M. Schwarz Robert Bosch GmbH, Germany
Prof. N. Stojadinović University of Niš, Serbia
Prof. V. Székely Technical University of Budapest, Hungary
Prof. T. Szmuc AGH University of Science and Technology, Poland
Dr. P. Śniatała Poznan University of Technology, Poland
Prof. M. Tadeusiewicz Technical University of Lodz, Poland
Dr. D. Tomaszewski Institute of Electron Technology, Warsaw, Poland
Dr. P. Tounsi INSA de Toulouse, France
Dr. M. Turowski Silvaco Inc., USA
Prof. R. Ubar Tallin Technical University, Estonia
Prof. G. Wachutka Technische Universitaet Muenchen, Germany
Prof. K. Wawryn Technical University of Koszalin, Poland
Prof. B. Więcek Technical University of Lodz, Poland
Prof. S. Yoshitomi Toshiba Corp., Japan
Prof. J. Zarębski Gdynia Maritime University, Poland
Dr. M. Zubert Technical University of Lodz, Poland

  • Organizing Committee

Prof. A. Napieralski (Chairman)
Dr. M. Orlikowski (Secretary)
Dr. M. Napieralska (Vice-Chairman)
Dr. G. Jabłoński Department of Microelectronics and Computer Science
Technical University of Lodz, Poland
Prof. W. Kuźmicz Institute of Micro- and Optoelectronics
Warsaw University of Technology, Poland

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Contact information

  • Mariusz Orlikowski (Conference Secreta)
  • mixdes2019@dmcs.p.lodz.pl

Sponsored By

  • Department of Microelectronics and Computer Science, Technical University of Lodz, Poland.
    Institute of Micro- and Optoelectronics Warsaw University of Technology, Poland.