COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 22 is to be held in Yokohama on April 17-19, 2019.

Call for paper

Important Dates

Draft paper submission deadline:2019-02-22

Topics of submission

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.


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Sponsored By

  • Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society

Supported By

  • IEEE Computer Society

Organized By

  • IEICE Electronics Society and IPSJ.