The 9th IEEE International Symposium on Next-Generation Electronics (ISNE 2020) will be held at Changsha, China on July. 11th to 13th, 2020. Based on the successful experiences on past ISNEs, the ISNE 2020 will continuously provide a platform for experts, scholars and researchers from all over the world to convene and share novel ideas on next-generation electronics.

The ISNE 2020 will feature plenary and invited talks by famous scientists in Microelectronic Devices and Materials, Microelectronic Circuits and Systems, Compound Semiconductor Materials, Electronic and Photonic Devices, Computer and Communication Engineering, Renewable and Sustainable Energy Device and Materials, Sensors, Packaging technologies, and Novel Applications in Science and Technology, Biomedical Electronics, and Advanced IC optoelectronic and MEMS Technologies.

The ISNE 2020 is supported by Changsha University of Science and Technology, IEEE Electron Devices Society and IEEE. 



Registration fee (Author Registration)

There is no relevant introduction

USD  500.00

Attendee Register

Call for paper Submit paper

Important Dates

Draft paper submission deadline:2020-04-05

Draft paper acceptance notification:2020-05-15

Final paper submission deadline:2020-05-31

Call for paper description


Comminication, Networking and Broadcast Technologies

Components, Circuits, Devices and Systems

Computing and Processing

Engineered Materials, Dielectrics and Plasmas

Fieldd, Waves and Electromagnetics

Photonics and Electrooptics

Power, Energy and Industry Apllications

Robotics and Control Systems

Signal Processing and Analysis


Leave a message


Important dates

  • Conference Dates

    11 Jul.



    13 Jul.


  • 05 Apr.


    Draft paper submission deadline

  • 15 May.


    Draft paper acceptance notification

  • 31 May.


    Final paper deadline

Conference News More>>

Contact information

  • Dr. WanghuiZou
  • +86 13517402460

Sponsored By

  • Changsha University of Science and Technology
    School of Physics and Electronics

Supported By

  • IEEE Electron Devices Society

Conference Series