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   With the feature size of silicon integrated circuit reduced to several nanometers, the speed, power consumption and heat dissipation of the circuit have become the bottleneck restricting the development of microelectronics industry. On the other hand, the new generation of information technology also puts forward higher requirements for processing speed, storage capacity and transmission rate of functional devices and systems. Therefore, the application of silicon photonics technology, combining microelectronics and optoelectronics on the silicon-based platform, giving full play to the mature technology of microelectronics, the low price brought by large-scale mass production, as well as the advantages of high bandwidth, ultra fast transmission rate and high anti-interference ability of photonics technology, has become the inevitable choice and general consensus of the industry. 
   The purpose of this conference is to discuss the latest progress, key issues and application requirements of silicon photonics technology, and promote its application in optical communication, data center architecture, optical computing, lidar, advanced sensing, biomedical research and other fields.

Call for paper


All accepted papers could choose to be included in the Conference Proceeding (EI Compendex).

Best Student Paper Award/ 5 winners

Any full-time university student, who is the first author as well as the presenter of a paper submitted with choosing presentation type of “Oral”will be eligible for this award. Oral presentation applications will be reviewed and evaluated by the Committee. If accepted, the contact author will receive notification of acceptance by email. Certificates and Awards will be presented to the winners at the conference award ceremony.

Best Poster Award/ 5 winners

Any poster paper that is registered by at least one of the authors, presented during the assigned time slot will be eligible for this award. Certificates and Awards will be presented to the winners at the conference award ceremony. 

Topics of submission

1. Lidar and sensing application
2. Optical computing and quantum information application
3. Data center and optical interconnect application
4. 5G application
5. Microwave photonics technology and application
6. Biomedical application
7. Other related applications

1. Silicon based laser technology (SiGe、Si based III-V laser)
2. Silicon based modulators and detectors
3. Silicon based passive devices
4. Silicon based packaging and testing technology
5. Silicon based heterogeneous integration technology (lithium niobate, silicon nitride, phase change materials, etc.)
6. Silicon based optoelectronic hybrid integration technology (optoelectronic chip, electronic chip for silicon photonics, etc.)
7. Silicon photonic chip design and processing platform 
8. Other related technologies 


Honorary Chairs

Qiming Wang, Institute of Semiconductors, CAS, China
Zhiping Zhou, Peking University, China

General Chairs

Shaohua Yu, China Information Communication Technologies Group Co., China
Yi Luo, Tsinghua University, China
Weiping Huang, Hisense Broadband Multimedia Technologies Co.,Ltd., China
Yidong Huang, Tsinghua University, China

TPC Chairs 

Xinliang Zhang, Huazhong University of Science and Technology, China
Wenfu Zhang, Xi'an Institute of Optics and Precision Mechanics, CAS, China

TPC Co-Chairs
Xingjun Wang, Peking University, China
Xi Xiao, China Information Communication Technologies Group Co., China
Chunlai Xue, Institute of Semiconductors, CAS, China
Mingbin Yu, SIMIT, China
Haisheng Rong, Intel, USA

TPC Members
Xinlun Cai, Sun Yat-sen University, China
Chang Chen, SITRI, China
Xue Feng, Tsinghua University, China
Junbo Feng, CUMEC, China
Wei Jiang, Nanjing University, China
Zhihua Li, Institute of Microelectronics, CAS, China
Liu Liu, Zhejiang University, China
Di Liang, Hewlett Packard Enterprise, USA
Haiqing Song, Harbin Institute of Technology, Shenzhen, China
Aimin Wu, SIMIT, China
Kaikai Xu, University of Electronic Science and Technology of China, China
Hui Yu, Zhejiang University, China
Yu Yu, Huazhong University of Science and Technology, China
Li Zeng, Huawei, China
Hua Zhang, Hisense Broadband Multimedia Technologies Co.,Ltd., China
Jia Zhao, Shandong University, China
Linjie Zhou, Shanghai Jiao Tong University, China
Weiwen Zou, Shanghai Jiao Tong University, China


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Important dates

  • Conference Dates

    03 Dec.



    05 Dec.


  • 31 Jul.


    Abstract submission deadline

  • 15 Oct.


    Draft paper submission deadline

Contact information


Sponsored By

  • Chinese Society for Optical Engineering

Supported By

  • United Microelectronics Center
    China Information Communication Technologies Group Co