The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.

Sponsor Type:1


Conference Chair

Kevin Zhang
Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Past Conference Chair

Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA

Senior Technical Advisor

Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

Executive Committee Secretary, Demo Session Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

Press Coordinator

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Executive Committee Secretary, Data Team, SRP Chair, Press Coordinator

Denis Daly
Apple, Wellesley, MA

Web Site & A/V Chair

Trudy Stetzler
Halliburton, Houston, TX

Director of Finance

John Weinmann
Rochester, NY

Program Chair

Makoto Ikeda
University of Tokyo, Tokyo, Japan
Oregon State University, Corvallis, OR

Call for paper

Important date

Draft paper submission deadline

Submission Topics

Innovative and original papers are solicited in subject areas including (but not limited to) the following:

ANALOG: Amplifiers, comparators, oscillators, filters, references; nonlinear analog circuits; digitally-assisted analog circuits; MEMS/sensor interface circuits.

DATA CONVERTERS: Nyquist-rate and oversampling A/D and D/A converters; embedded and application-specific A/D and D/A converters; analog to information conversion; time-to-digital converters.

DIGITAL CIRCUITS and ARCHITECTURES & SYSTEMS: Digital circuits, building blocks, and complete systems (monolithic, 2.5D, and 3D) for microprocessors, micro-controllers, application processors, graphics processors; digital systems for communications, video and multimedia, cryptography, smart cards, security and trusted computing, accelerators, reconfigurable systems, near- and sub-threshold systems, emerging applications. Digital circuits for intra-chip communication, clock distribution, soft-error and variation-tolerant design, power management (i.e. voltage regulators, adaptive digital circuits, digital sensors), PLLs for digital clocking applications, and security circuits (i.e. PUFs, TRNGs, side-channel attack countermeasures, and attack-detection sensors).

IMAGERS, MEMS, MEDICAL, & DISPLAYS: Image sensors and SoCs; automotive, LIDAR, and ultrasonic sensors; MEMS sensor systems; wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; display electronics, displays with sensing functionality; sensing for AR/VR.

MACHINE LEARNING and AI: Chips demonstrating system, architecture and circuit innovations for machine learning and artificial intelligence: processor architectures, accelerators and digital circuits; mixed-signal, analog, near-sensor and in-sensor processing schemes; architectures leveraging near-memory and in-memory computation, using volatile or non-volatile memories.

MEMORY: Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O interfaces; memories based on phase-change, magnetic, spin-transfer-torque, ferroelectric, and resistive materials; array architectures and circuits to improve low-voltage operation, power reduction, reliability, and fault tolerance; application-specific circuit enhancements within the memory subsystem, including in-memory logic functions and compute.

POWER MANAGEMENT: Power management and control circuits, regulators; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; energy harvesting circuits and systems; wide-bandgap topologies and gate-drivers; power and signal isolators; robust power management circuits for automotive and other harsh environments; circuits for lighting, wireless power and envelope modulators.

RF CIRCUITS and WIRELESS SYSTEMS: Building blocks and complete solutions at RF, mm-Wave and THz frequencies for receivers, transmitters, frequency synthesizers, transceivers, SoCs, and SiPs. Innovative circuit-level and system-architecture solutions for established wireless standards and future systems or applications such as radar, sensing, and imaging.

TECHNOLOGY DIRECTIONS: Emerging IC and system solutions for: biomedical, sensor interfaces, analog signal processing, power management, computation (including non-CMOS machine learning), data storage, and communication; non-silicon-, carbon-, organic-, metal-oxide-, compound-semiconductor- and new-device-based circuits; nano, flexible, large-area, stretchable, printable, spintronics, quantum, optical, integrated photonics, and 3D-integrated electronics.

WIRELINE: Receivers/transmitters/transceivers for wireline systems, including backplane transceivers, optical links, chip-to-chip
communications, 2.5/3D interconnect, copper-cable links, and equalizing on-chip links; exploratory I/O circuits for advancing data rates, power efficiency, equalization, robustness, adaptation capability, and design methodology; building blocks for wireline transceivers (such as AGCs, analog and ADC/DAC-based front ends, equalizers, clock generation and distribution circuits including PLLs, line drivers, and hybrids).

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Important Date
  • Conference Date

    Feb 13



    Feb 22


  • Sep 09 2020

    Draft paper submission deadline

Sponsored By
IEEE Solid-State Circuits Society