ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Due to ongoing COVID-19 uncertainty and travel restrictions, the ICEP Organizing Committee has decided that ICEP 2021 will be held as an all-online event, instead of on-site and in-person meeting originally planned to take place in Tokyo.

Sponsor Type:5; 9


General Chair
Eiji Higurashi, National Institute of Advanced Industrial Science and Technology

General Vice Chair
Shigenori Aoki, LINTEC
Katsumi Miyama, Hokkaido University of Science
Akitsu Shigetou, National Institute for Materials Science

Technical Program Committee Chair
Akitsu Shigetou, National Institute for Materials Science

Technical Program Committee Vice Chairs
Shinya Takyu, LINTEC
Naotaka Tanaka, Hitachi Chemical
Yoshihiro Tomita, Intel

Technical Program Committee Members
Tomoyuki Abe, FUJITSU
Toyohiro Aoki, IBM Japan
Masahiro Aoyagi, National Institute of Advanced Industrial Science and Technology
Takahiro Arakawa, Tokyo Medical and Dental University
Noriyuki Fujimori, OLYMPUS
Koichi Hasegawa, JSR
Nobuaki Hashimoto, Suwa University of Science
Tomoyuki Hatakeyama, Toyama Prefectural University
Sumito Hayashida, ASE Group
Koichi Hirano, Prime planet energy & solutions
Hiroshi Hozoji, National Institute of Advanced Industrial Science and Technology
Yuki Inaba, DENSO
Masahiro Inoue, Gunma University
Yukihiro Kanechika, Tokuyama
Takashi Kasahara, Hosei University
Yu Kondou, OLYMPUS
Tadao Matsunaga, Tottori University
Jun Mizuno, Waseda University
Yasuhiro Morikawa, ULVAC
Toshio Nonaka, Huawei Technologies Japan
Masaaki Oda, Printed Electronics Network
Takayuki Ohba, Tokyo Institute of Technology
Hideo Ohkuma, HTO
Kazuya Okamoto, Yamaguchi University
Tetsuya Onishi, Grand Joint Technology
Hitoshi Sakamoto, Huawei Technologies Japan
Yoichiro Sato, AGC
Koichi Shibayama, Sekisui Chemical
Osamu Suzuki, NAMICS
Fumio Uchikoba, Nihon University
Shoji Uegaki, E-ThermoGentek
Hiroshi Yamada, Toshiba
Kiyokazu Yasuda, Osaka University

Operation Committee Chair
Katsumi Miyama, Hokkaido University of Science

Operation Committee Vice Chairs
Hajime Hirata, Toray Engineering
Koichi Hirata, Namics
Mitsuyo Miyauchi, ALPHA-DESIGN
Miki Mori, the University of Tokyo
Yoshio Nogami, Toray Engineering
Akira Yamauchi, National Institute of Technology, Gunma College

Operation Committee Members
Hidenobu Deguchi, Sekisui Chemical
Ryo Endoh, Toray Research Center
Jin Fujimura, ePRONICS
Minami Kaneko, Nihon University
Hidetoshi Kitaura, Panasonic
Yoshiteru Kono, OMRON
Makiko Nagao, Nagase
Keishi Okamoto, Huawei Technologies Japan
Taiji Sakai, Fujitsu Interconnect Technologies
Kazuo Shimokawa, Toshiba
Jun Shirakami, DIC
Takahito Watanabe, IBM Japan
Noriyasu "Notch" YAMANE, Mitsubishi Chemical
Akira Yamauchi, Bondtech

Publication Chair
Tomoyuki Hatakeyama, Toyama Prefectural University

Publication Member
Hitoshi Sakamoto, Huawei Technologies Japan

Finance Chair
Taiji Sakai, Fujitsu Interconnect Technologies

Finance Vice Chair
Shoichi Ishikawa

Yasuhiro Ando, ABI Giken
Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology
Masaru Ishizuka, Toyama Prefectural University
Kaoru Hashimoto, Meisei University
Kenzo Hatada, Atomnics Laboratory
Hideyuki Nishida, NEP Tech. S & S
Takashi Nukii, Kyoko University
Atsushi Okuno, Green Planets
Kanji Otsuka, Meisei University
Osamu Shimada, Dai Nippon Printings
Yuzo Shimada, Japan Jisso Technology Transfer Association
Tadatomo Suga, Meisei University
Katsuaki Suganuma, Osaka University
Shinichi Wakabayashi, Nagano Techno Foundation
Kishio Yokouchi, Japan Interconnect-Solution Laboratory

Call for paper

Important date

Abstract submission deadline

Submission Topics

Topics Category 1

Advanced Packaging
Quality, Modeling, and Reliability

Topics Category 2

Materials and Processes

Topics Category 3

Emerging Technologies
High-Speed, Wireless & Components
Thermal Management
Power Electronics


All contributed authors excluding invited authors are required to submit a final 2-page paper of their work for publication in the conference proceedings.

Papers that do not meet the regulations shown below will not be published in the conference proceedings.

The copyright of the paper must be transferred to JIEP at the time of the final submission.

Only the papers submitted by due date will be considered for the conference awards.

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Important Date
  • Conference Date

    May 12



    May 14


  • Dec 14 2020

    Abstract Submission Deadline

Sponsored By
Japan Institute of Electronics Packaging Tokyo/FK/HR/NG/SP/SN/SE/SK Jt Sec EP Chapter
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