Introduction

About Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; Photonics and Electrooptics
Keywords:The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.,,,
Scope:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Sponsor Type:1

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Important Date
  • Conference Date

    May 25

    2026

    to

    May 30

    2026

Sponsored By
IEEE Electronics Packaging Society
Supported By
Institute of Electrical and Electronics Engineers
Contact Information
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