Introduction

Welcome to the 28th iteration of the IEEE Hot Interconnects symposium. HotI28 will be held August 18-20, 2021.

IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

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Call for paper

Important date

2021-05-07
Abstract submission deadline
2021-05-14
Draft paper submission deadline

Submission Topics

Topics of Interest (but not limited to these):

Novel and innovative interconnect architectures
Multi-core processor interconnects
System-on-Chip Interconnects
Advanced chip-to-chip communication technologies
Optical interconnects Protocol and interfaces for inter-processor communication
Survivability and fault-tolerance of inter-connects
High-speed packet processing engines and network processors
Systems software for communication
System and storage area network architectures and protocols
High-performance host-network interface architectures
High-bandwidth and low-latency I/O
Pb/s switching and routing technologies
Innovative architectures for supporting collective communication
Novel communication architectures to support cloud & grid computing
Centralized and distributed cloud interconnects
Requirements driving high-performance interconnects
Traffic characterization for HPC systems and commercial data centers
Software-defined networking and software overlay networks
Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
Data Center Networking

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Important Date
  • Conference Date

    Aug 18

    2021

    to

    Aug 20

    2021

  • May 07 2021

    Abstract Submission Deadline

  • May 14 2021

    Draft paper submission deadline

Sponsored By
IEEE Computer Society
Contact Information
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