Introduction

AboutComputing and Processing; Engineering Profession; General Topics for Engineers
Keywords:Engineering Education,IFEES,WEEF,GEDC,IEEE Education Society,
Scope:Diversity and Ethics in Education for an Inclusive and Sustainable World
Sponsor Type:1; 9; 9; 9; 9

Committee

GENERAL CO‐CHAIRS

  • Edmundo Tovar, UPM, Spain
  • Hans Jürgen Hoyer, IFEES, GEDC, USA
  • Manuel Castro, UNED, Spain

PROGRAM CO‐CHAIRS

  • Mª Joao Monteiro, President, ISEP, Portugal
  • Paloma Diaz, Dean Engineering School, Universidad Carlos III de Madrid, Spain
  • Carlos Delgado Kloos, Coordinator, eMadrid Network & Vice President, Universidad Carlos III de Madrid, Spain
  • Sunil Maharaj, WEEF/GEDC 2020 and 2022, University of Pretoria, South Africa
  • Şirin Tekinay, GEDC Chair, University of Sharjah, UAE

TECHNICAL PROGRAM CO‐CHAIRS

  • Gustavo R. Alves, ISEP & SPEE, Portugal
  • Pablo Fajardo, ViceDean of Engineering School, Universidad Carlos III de Madrid, Spain
  • Arcelina Marques, ISEP, Portugal
  • Helen Inglis, WEEF/GEDC 2020 and 2022, University of Pretoria, South Africa

HONOR COMMITTEE

  • Şirin Tekinay, GEDC Chair, University of Sharjah
  • Alaa Ashmawy, IFEES President, Egypt, Co-Chair
  • Ricardo Mairal Uson, Rector, EADTU, UNED, Spain
  • Guillermo Cisneros Pérez, Rector, UPM, Spain
  • Juan Romo, Rector Universidad Carlos III de Madrid, Spain
  • Héctor Rubén Paz, Rector, Universidad Nacional de Santiago del Estero, Argentina
  • Shiyi Chen, GEDC, PRC
  • Satish Udpa, GEDC, USA
  • Guillermo Oliveto, GEDC LATAM Chair
  • Michael K.J. Milligan, Executive Director, Chief Executive Officer, ABET, USA
  • Michael E. Auer, IAOE Founding President & CEO, IFEES, Austria
  • Susan K. Land, IEEE President, USA
  • Stephen Welby, IEEE Executive Director, USA
  • Antonio Luque Estepa, IEEE Region 8 Director, Spain
  • Soma Chakrabarti, ANSYS Granta, President, IACEE, IFEES, UK
  • Mario Chauca, General Chair International Institute of Innovation and Technology, IFEES, Peru
  • You Zheng, Chinese Society for Engineering Education, Vice President of Tsinghua University, IFEES, PRC
  • Tuncay Döğeroğlu, Eskişehir Teknik University, GEDC, Turkey
  • Cesar Parga, OAS, USA
  • Javier Soriano, President of the Spanish Council of Deans of Informatics Engineering - CODDI, Dean ETS de Ingenieros Informáticos, UPM
  • Fernando Suárez, President Spanish General Council of Informatics Engineering – CCII, Spain
  • Joaquín González Casal, Dean of the Madrid Professional College Computer Engineers, Spain
  • Enrique Amezua, President of CDII, Spain
  • José Milán, President, Grupo Pacifico Meetings & Events, Spain
  • Jaime Alberto Leal Afanador, President, AIESAD, Colombia
  • Roberto Carlos Hincapié Reyes, President, ACOFI, IFEES, Colombia
  • Luis Alberto González Araujo, Director Ejecutivo, ACOFI, IFEES, Colombia
  • Mihoko Kumamoto, Director, UNITAR, IFEES, GEDC, Japan
  • Debbie Blaine, President, SASEE, IFEES, South Africa
  • Vanderli Fava de Oliveira, President, ABENGE, IFEES, Brazil
  • Jaime Salazar Contreras, Executive Secretary, ASIBEI, IFEES, Colombia
  • José Basterra, President, CONFEDI, IFEES, Argentina
  • Gudrun Kammasch, SSEE/IPW, IFEES, Germany
  • George Ubachs, Managing Director, EADTU, Belgium
  • Torunn Gjelsvik, Secretary General, ICDE, Norway
  • Abul K.M. Azad, GOLC President, Austria
  • Nevena Mileva, Pro-Rector, Dean, FPT, Bulgaria
  • Saurabh Sinha, Deputy Vice-Chancellor: Research and Internationalisation, University of Johannesburg, South Africa

INTERNATIONAL ADVISORY AND SCIENTIFIC BOARD

  • Rosa M. Martin Aranda, Research, Knowledge Transfer and Scientific Divulgation Vicerector, UNED
  • Laura Alba Juez, Internationalization Vicerector, UNED
  • Jesus Gonzalez Boticario, Digitalization and Innovation, UNED
  • Julio Lumbreras Martin, Academic Strategy and Internationalization Vicerrector, UPM, Spain
  • Francisco Javier Jiménez Leube, Communications and Institutional Relationships Vicerrector UPM, Spain
  • Asunción de María Gómez Pérez, Research, Innovation and Doctorate Vicerrector, UPM, Spain
  • Victor Gomez Frias, EELISA Rector Delegate, UPM, Spain
  • Jose Miguel Atienza Riera, Academic Transition and Internationalization Rector Delegate, UPM, Spain
  • Stephen M. Phillips, IEEE Vice President, Educational Activities, USA
  • Jamie Moesch, IEEE Educational Activities Director, IFEES, USA
  • Russ Meier, MSoE & IEEE, USA
  • Jim Sluss, University of Oklahoma & IEEE, USA
  • Rafael Jiménez Castañeda, Prof. Electrical Engineering, Vice Rector, Cádiz University
  • Eduardo Vendrell Vidal, Vice-Rector for Studies, Quality and Accreditation, Universidad Politecnica de Valencia
  • Ali Ashrafi Zadeh, ISEE, IFEES, Iran
  • Jean-Pierre Auffret, George Mason University, IFEES, USA
  • Carlos Arturo Lozano Moncada, ACOFI, IFEES, Colombia
  • José Juan Calvín, Universidad de Cádiz. Spain
  • Babak Basheti, NYIT, USA
  • Manel Martínez Ramón, University of of New Mexico, USA
  • María Teresa Garibay, Faculty of Exact Sciences, Engineering and Surveying, National University of Rosario, Argentina
  • María Isabel Pozzo, Director Center of Studies of Spanish as a Foreign Language (CELE), Humanities & Arts Faculty, National University of Rosario, Researcher IRICE (CONICET-UNR), Argentina
  • Ramiro Jordan, University of New Mexico, IFEES, WEEF/GEDC 2018 and 2020, USA
  • Uriel Cukierman, Universidad Tecnológica Nacional, Argentina
  • Eleonore Lickl, IGIP’s Executive Committee, IFEES, Austria
  • Gloria Kim, Korean Society for Engineering Education, IFEES, USA
  • Luis Manuel Sánchez Ruiz, SEFI BoD member, IFEES, Spain
  • Khairiyah Mohd Yusof, Universiti Teknologi, Malaysia
  • Susan Oh, Muckr AI, South Korea
  • Stephanie Farrell, Rowan University, USA
  • Sushma Kulkarni, Rajarambapu Institute of Technology, India
  • Theo Andrew, Durban University of Technology, South Africa
  • Ariela Sofer, George Mason University, Academic Director of INCOSE, IFEES, USA
  • Manel Martínez‐Ramón, Professor and Endowed Chair of King Felipe VI, University of New Mexico, USA
  • Sarah Zappe, Director of Assessment and Instructional Support, Pennsylvania University, USA
  • Aruquia Barbosa Matos Peixoto, CEFET/RJ, Editor of the Special Issue Women, Diversity and Equity of the IEEE-RITA, Brazil and Chair of the Special Session IDEE (inclusion and Diversity in Engineering Education) of the IEEE EDUCON, Brazil
  • Sarah Zappe, Pennsylvania University, USA
  • Abul K.M. Azad, GOLC, Austria
  • Francisco J. Azcondo, Dean of the School of Industrial and Telecommunication Engineering. University of Cantabria, Spain
  • Inmaculada Plaza, Director of the EUPT – University of Zaragoza, Spain
  • Oscar Martinez Bonastre, IEEE Spain Section Chair & Spanish Chapter Chair, IEEE Education Society, Spain
  • Pedro Fonseca, Chair, Portugal Chapter Chair, IEEE Education Society, Portugal
  • Pedro Plaza Merino, President of the IEEE Student Branch in UNED
  • Juan D. Aguilar Peña, President of the Spanish Association of Technology, Teaching and Learning of Electronics (TAEE)
  • Ken Ball, GEDC, George Mason University, USA
  • Zhenghe Xu, GEDC, SUSTech, PRC
  • Sushma Kulkarni; GEDC, RIT India
  • Manivannan Kaliappan, GEDC, India
  • Elizabeth Croft, GEDC, Australia
  • Funso Falade, IFEES, GEDC, Nigeria
  • Christian Bolu, GEDC, Nigeria
  • Adagbonyin Obiazi, GEDC, Nigeria
  • Kristina Ropella, GEDC, USA
  • Keith J Bowman, GEDC, USA
  • Cristina Amon, GEDC, Canada
  • Sarah Rajala, GEDC, USA
  • Natacha DePaola, GEDC, USA
  • Juan Carlos de la Llera, GEDC, PUC, Chile
  • Tagwa Musa, GEDC, Sudan
  • Hamadou Saliah-Hassane; TELUQ, IEEE Education Society, Canada and Niger
  • Francisco.Javier Segovia Pérez, EIT, Montegancedo Campus Rector Delegate UPM, Spain
  • John Mitchell, EIC of IEEE ToE, UK
  • Mark Lee, EIC of IEEE TLT, Australia and USA
  • Johann M. Marquez-Barja, University of Antwerp/IMEC, Belgium
  • Bill Williams, REEN, IFEES, Portugal
  • Francisco García Peñalvo, USAL, Spain
  • Julieta Noguez, ITESM, Mexico
  • Eduardo Mecías, ITESM, Mexico
  • Juarez Bento da Silva, Brazil
  • Clara Viegas, Portugal
  • Yaseen Taha Mustafa, University of Zakho, Iraq
  • John Heywood, Trinity College, UK 

INTERNATIONAL ADVISORY AND INDUSTRY BOARD

  • Michael Fors, Boeing, USA
  • Marc Fry, ANSYS, UK
  • Soma Chakrabart, ANSYS, IACEE, UK
  • Paul Gilbert, Quanser, Canada
  • Dora Smith, Siemens, USA
  • Armin Veitl, Altair, Germany
  • Klaus Hengsbach, Phoenix, Germany
  • Dave Wilson, National Instruments, USA
  • Mitrankur Majumdar, Infosys
  • Danny Lin, Huawei, PRC
  • P.J. Boardman, Mathworks, USA
  • Xavier FOUGER, Dassault Systèmes, France
  • Jean-Brice Dumont, Airbus, France
  • Ron Hyman, LiaisonEDU, USA
  • Michael E. Auer, CTI, IAOE, IFEES, Austria
  • Nihat Bayiz, Arçelik, Turkey
  • Pablo Orduña, Labsland, Spain & USA
  • Kalyan Ram, Electrono Solutions, India

INTERNATIONAL ADVISORY AND STUDENTS BOARD

  • Yashin Brijmohan, WEEF 2020
  • Aniek van Kersen, WEEF 2020
  • Azeez Mohideen Mohamed Nazeer, WEEF 2020
  • Felipe Gomez Gallo, IFEES, SPEED President
  • Kelvin Kiprono, SPEED VP Africa
  • Laura Restrepo Alameda, SPEED VP Strategic Development
  • Maria Laura Polo, SPEED VP Educational Content
  • Nor Azlinda Azmi, WEEF 2020
  • Raheel Pathan, SPEED VP Members Relation
  • Radhika Gautam Gunaji, SPEED VP Administration
  • Sanket Dhadke, WEEF 2020
  • Ximena Velandia, SPEED VP Latin America
  • Johannes Spaas, President BEST, WEEF 2020
  • Mina Mitrovic, Treasurer BEST
  • Daniel Ansia Dibuja, Past Secretary BEST, WEEF 2020
  • Alex Julius, ESW, USA
  • Alen Amini, ESW, USA
  • Elisa Barney Smith, IEEE MGA Students Activity Committee Chair, USA
  • George Papadimitriou, IEEE Region 8 Student Representative, Greece
  • Maciej Borówka, IEEE Region 8 Chair Student Activities, Poland
  • Efthymia Arvaniti, IEEE Region 8 Past-Chair Student Activities, Austria
  • Ángela Martínez, IEEE Region 8 Student Activities Committee member, Spain
  • Ron Jensen, IEEE HKN President, USA
  • Ed A. Rezek, IEEE HKN Past President, USA
  • Karen Panetta, IEEE HKN Past President, USA
  • Nancy Ostin, IEEE HKN Director, USA
  • Lorena Garcia, IEEE HKN Region 7 to 10 Governor, Colombia
  • Sandro Sartoni, IEEE HKN Student Governor, Italy
  • Katelyn Brinker, IEEE HKN Past Student Governor, USA

LOCAL COMMITTEE

  • Clara Pérez, UNED, Spain
  • Francisco Mur, UNED, Spain
  • Gabriel Díaz, UNED, Spain
  • Sergio Martín, UNED, Spain
  • Elio Sancristóbal, UNED, Spain
  • Rosario Gil, UNED, Spain
  • Blanca Quintana, UNED, Spain
  • Félix García Loro, UNED, Spain
  • Roberto Hernández, UNED, Spain
  • Miguel Rodríguez Artacho, UNED, Spain
  • Rafael Pastor, UNED, Spain
  • Antonio Robles, UNED, Spain
  • Llanos Tobarra, UNED, Spain
  • Elena Ruiz, UNED, Spain
  • Germán Carro, UNED La Coruña, Spain
  • Pedro Plaza, UNED, Spain
  • Antonio Menacho, UNED, Spain
  • Manuel Blázquez, UNED, Spain
  • Alejandro Macho, UNED, Spain
  • Pablo Baizán, UNED, Spain
  • Bernardo Tabuenca, UPM, Spain
  • Rosa Cabedo, UPM, Spain
  • Juan Jose Morillas, UPM, Spain
  • Jesús Fraile‐Ardanuy, UPM, Spain
  • Pedro Muñoz, UC3M, Spain
  • Ruth Cobos, Universidad Autónoma de Madrid, Spain
  • Pilar Rodríguez, Universidad Autónoma de Madrid, Spain
  • Ángel Velázquez, Universidad Rey Juan Carlos de Madrid, Spain
  • Baltasar Fernández Manjón, Universidad Complutense de Madrid, Spain
  • Oscar Martínez Bonastre, UMH, Spain
  • Carina González, Universidad de La Laguna & Universidad Oberta de Cataluña, Spain
  • Martín Llamas Nistal, Universidad de Vigo, Spain
  • Manuel Caeiro, Universidad de Vigo, Spain
  • Manuel Gericota, ISEP, Portugal
  • André Fidalgo, ISEP, Portugal
  • Aliki Pappas, IFEES, GEDC, USA
  • Salma Wahba, IFEES, GEDC, USA

PROGRAM COMMITTEE

  • Alicia García Holgado, USAL, Spain
  • Natércia Lima, ISEP, Portugal
  • Shannon Chance, UCL, UK
  • Inês Direito, UCL, UK
  • Diana Mesquita, University of Minho, Portugal
  • Maria Cristina Costa-Lobo, IESFafe, Portugal
  • Carlos Felgueiras, ISEP, Portugal
  • Dominik May, UGA, USA
  • Simone Bilessimo, UFSC, Brazil
  • Razwan Najimaldeen, UOD, Iraq
Call for paper

Important date

2021-04-30
Abstract submission deadline
2021-05-15
Abstract notification of acceptance
2021-06-30
Draft paper submission deadline
2021-09-10
Draft paper acceptance notification
2021-09-20
Final paper submission deadline

The theme of the Conference is Diversity and Ethics in Education for an Inclusive and Sustainable World. Education drives the world and through engineering education, and in our roles as educators, academia, institutions and students, we are part of the forces that we can support, reinforce, vitalize and respond to the needs of inclusion, diversity and sustainability inside our present and future.

Submission Topics

We invite submissions for papers, workshops, panels and Special Sessions, which address the following themes (though not limited to this list):

  • Women in engineering and engineering education
  • Mental Health in engineering education
  • Peace engineering
  • The ethical challenge and engineering education
  • Diversity, gender, identity and multicultural education
  • Mobility: virtual, programs and internships
  • Graduate attributes for the future engineer
  • Strengthening engineering education in developing countries
  • K-12 STEM Education Initiatives
  • Student-Centered Learning Environments
  • Engineering education student organizations
  • International studies and students
  • Teamwork and mentoring
  • Progression, retention, attrition and persistence
  • Multicultural diversity in the workplace
  • Sustainability and Sustainable Development Goals (SDGs)
  • Online and blended learning
  • Future of the engineering education
  • Scholarship of Teaching and Learning
  • Development of engineering educators
  • Engaging Undergraduate Students in Research
  • Climate change and engineering education
  • Mastering Digitalization, Artificial Intelligence and Machine Learning
  • Game-Based Learning and Gamification for Engineering Education
  • Lab concepts (traditional, online, remote, pocket) in Engineering Education
  • Data driven engineering education
  • Automation technology and machine safety
  • Future of skills for the Industry
  • Lifelong learning in a changing world
  • University and industry/institutions and connections
  • Virtual and distributed workforce
  • Foundations of the university of the future
  • Work integrated learning in a virtual environment

Guidlines

Paper Preparation and Submission
All submission types must use the IEEE template (A4).
All paper publication, presentations and activities of the conference will be in English.


Contribution Types

  • Papers: Full papers (6-10 pages).
  • Special Sessions
  • Panels and Round Tables
  • Workshops

For all types of contributions the author must send an extended blind abstract (1 to 2 pages maximum and a Summary of maximum of 600 words that will be included in the conftool application submission) to be evaluated. Only accepted extended abstracts must be sent full papers. All the conference papers will be double-blind reviewed. Final papers that are accepted after peer review will be published in the conference proceedings. Each author registration can include a maximum of two papers (one included in the registration and one with additional payment).

Where to upload
All files must be uploaded to the ConfTool® Submission Server. IMPORTANT: We work with the metadata that you submit along with your paper, so please:

  • Submit correct data:
    • correct spelling of authors' names in paper and metadata,
    • coherent spelling of authors' names trough all your papers if you have more than one
    • do not inverse first name/last name etc.
    • when changing authors or title in your paper, please modify also the metadata in conftool
  • Observe the deadlines: Reference time for deadlines is the time displayed in Conftool!
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Important Date
  • Conference Date

    Nov 15

    2021

    to

    Nov 18

    2021

  • Apr 30 2021

    Abstract Submission Deadline

  • May 15 2021

    Abstract Notification of Acceptance

  • Jun 30 2021

    Draft paper submission deadline

  • Sep 10 2021

    Draft Paper Acceptance Notification

  • Sep 20 2021

    Final Paper Deadline

  • Sep 20 2021

    Early Bird Registration

Sponsored By
Global Engineering Deans Council IEEE Education Society International Federation of Engineering Education Societies – IFEES National Distance Education University (UNED) Universidad Politecnica de Madrid
Supported By
The Global Engineering Deans Council
IFEES
Contact Information
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