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Introduction

With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, the 1st ITC-Asia was initiated in Taipei in 2017, and the 2nd ITC-Asia was held with great success in Harbin China in 2018. The 3rd ITC-Asia will be held in Tokyo Japan in 2019.

Attendee can involve themselves in attractive sessions on the state-of-the-art test technology trend and several industry topics. We kindly invite you to submit your work to ITC-Asia 2021. The outstanding papers with extension will be invited to ITC-2021.

 

Committee

Steering Committee Members

Kuen-Jong Lee (Chair) National Cheng Kung Univ.
Cheng-Wen Wu National Tsing Hua Univ.
Li-C. Wang (representing ITC) UCSB
Yervant Zorian (representing TTTC) Synopsys
Xiaowei Li Inst. of Comput. Technology, CAS

Tutorial Chair

Pingqiang Zhou Shanghai Tech University

Special Session Chair

Jiang Li Shanghai Jiaotong University

US Liaison

Krishnendu Chakrabarty Duke University

Japan Liaison

Tomoo Inoue Hiroshima City University

General Co-Chairs

Jianhui Jiang Tongji University
Zebo Peng Linköping University

Technical Program Co-Chairs

Jing Ye Inst. of Comput. Technology, CAS
Gang Qu University of Maryland
Ying Zhang Tongji University

Industry Sessions Chair

Yu Huang HiSilicon

Finance Chair

Hongming Zhu Tongji University

Publicity Chair

Shi-Yu Huang National Tsing Hua Univ

Publication Chair

Zezhi He Shanghai Jiaotong University

PC Member

Davide Appello STMicroelectronics Jin-Fu Li National Central University
John Carulli GLOBALFOUNDRIES Katherine Shu-Min Li National Sun Yat-Sen University
Mango Chao National Chiao Tung University Huaguo Liang Hefei University of Technology
Vivek Chickermane Cadence Design Sstems Dimitris Nikolos University of Patras
Stephan Eggersglüß Mentor Graphics Alex Orailoglu University of California San Diego
Masahiro Fujita The University of Tokyo Ilia Polian University of Stuttgart
Anne Gattiker IBM Janusz Rajski Mentor, A Siemens Business
Dimitris Gizopoulos University of Athens Matteo Sonza Reorda Politecnico di Torino
Charles H.-P. Wen National Chiao Tung University Juergen Schloeffel Mentor Graphics
Sybille Hellebrand University of Paderborn Saghir Shaikh Braodcom Ltd.
Hao-Chiao Hong National Yang Ming Chiao Tung University Virendra Singh Indian Institute of Technology (IIT) Bombay
Jiun-Lang Huang National Taiwan University Hiroshi Takahashi Ehime University
Shi-Yu Huang National Tsing Hua University, Taiwan Mark Tehranipoor University of Florida
Tsung-Chu Huang National Changhua University of Education Kar Meng Thong Infineon Technologies Asia Pacific
Michiko Inoue Nara Institute of Science and Technology Daniel Tille Infineon Technologies AG
Tomoo Inoue Hiroshima City University Hans Tsai Mentor Graphics
Masahiro Ishida ADVANTEST Corporation Jerzy Tyszer Poznan University of Technology
Li Jiang Shanghai Jiao Tong University Gherman Valentin CEA
Seiji Kajihara Kyushu Institute of Technology Sying-Jyan Wang National Chung Hsing University
Sungho Kang Yonsei University Xiaoqing Wen Kyushu Institute of Technology
Haruo Kobayashi Gunma University Dong Xiang Tsinghua University
Huawei Li Institute of computing, Chinese Academy of Sciences Qiang Xu The Chinese University of Hong Kong
Call for paper

Important date

2019-01-25
Draft paper submission deadline

Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceeding. Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. At least one full registration to the conference is required for each accepted paper.

Submission Topics

Topics of Interests include (but are not limited to) the following topics:

  • Autonomous Testing

  • Heterogeneous Testing

  • Reliability and Testing for Approximate/Quantum Computing

  • Hardware Oriented Security and Trust

  • Design Validation and Debug

  • ATE Design

  • Analog and Mixed-Signal Test

  • RF Test

  • High-Speed I/O Test

  • Fault Modeling and Simulation

  • ATPG (Automatic Test Pattern Generation)

  • Design for Testability

  • Built-In Self-Test

  • Delay Test

  • System-on-Chip Test

  • Test Compression

  • Power-Aware and/or Thermal-Aware Test

  • Memory Test, Diagnosis, and Repair

  • Fault Diagnosis and Failure Analysis

  • Yield Analysis and Learning

  • Safety and Test for Automotive ICs

  • Test for Internet of Things

  • Test for Emerging Devices

  • CPU/GPU Test

  • MEMS/Sensor Test

  • Online Test

  • On-Chip Measurement

  • SiP, 2.5D, and 3D IC Test

  • Interconnect Test

  • Board-Level Testing and Diagnosis

  • Test Standards

  • Test Economics

  • Reliability Issues

  • Fault Tolerance

  • Test for Reconfigurable Systems

  • Software Test and Reliability

  • Dependable Systems and Networks

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Important Date
  • Conference Date

    Aug 19

    2021

    to

    Aug 20

    2021

  • Jan 25 2019

    Draft paper submission deadline

Supported By
Tongji University
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