Parallel DICE Cells and Dual-Level CEs based 3-Node-Upset Tolerant Latch Design for Highly Robust Computing
ID:61 View Protection:PUBLIC Updated Time:2021-08-16 20:35:47 Hits:780 Oral Presentation

Start Time:2021-08-20 11:30(Asia/Shanghai)

Duration:20min

Session:RS Regular Paper Session » RS3A4 Circuit Design and Evaluation with Emerging Technology

Abstract
Dr. Aibin Yan is an IEEE/CCF Senior Member, a PhD supervisor and an Associate Professor with School of Computer Science and Technology, Anhui University (AHU), China. He received a Ph.D degree in Computer Application Technology from Hefei University of Technology, China, and a M.S. degree in Software Engineering from the University of Science and Technology of China (USTC), Hefei, in 2015 and 2009, respectively. He joined Anhui University, Hefei, in 2016. During 2018.9-2019.9, he visited the WEN Lab, Kyushu Institute of Technology, Japan, under the support of China Scholarship Council (CSC), and under the supervision of Prof. Xiaoqing WEN, an IEEE Fellow, for a full year of time. During that year, he participated in chip design, tape out and test. On July 2021, he created the AHU Institute of Chip Design and Test serving as a director. In recent years, he served as a Session Chair of 52nd IEEE International Symposium on Circuits and Systems, Publicity Chair and TPC Member of 27th IEEE Asian Test Symposium. His research interests mainly include radiation hardening by design for nano-scale CMOS ICs such as latches, flip-flops, and memory cells. Details can be found through his website: http://ca.hfut.edu.cn/xyz/
Keywords
Speaker
Aibin Yan
Associate professor Anhui University

Dr. Aibin Yan is an IEEE/CCF Senior Member, a PhD supervisor and an Associate Professor with School of Computer Science and Technology, Anhui University (AHU), China. He received a Ph.D degree in Computer Application Technology from Hefei University of Technology, China, and a M.S. degree in Software Engineering from the University of Science and Technology of China (USTC), Hefei, in 2015 and 2009, respectively. He joined Anhui University, Hefei, in 2016. During 2018.9-2019.9, he visited the WEN Lab, Kyushu Institute of Technology, Japan, under the support of China Scholarship Council (CSC), and under the supervision of Prof. Xiaoqing WEN, an IEEE Fellow, for a full year of time. During that year, he participated in chip design, tape out and test. On July 2021, he created the AHU Institute of Chip Design and Test serving as a director. In recent years, he served as a Session Chair of 52nd IEEE International Symposium on Circuits and Systems, Publicity Chair and TPC Member of 27th IEEE Asian Test Symposium. His research interests mainly include radiation hardening by design for nano-scale CMOS ICs such as latches, flip-flops, and memory cells. Details can be found through his website: http://ca.hfut.edu.cn/xyz/

Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Aug 18

    2021

    to

    Aug 20

    2021

  • May 10 2021

    Draft paper submission deadline

  • Aug 16 2021

    Early Bird Registration

  • Aug 19 2021

    Contribution Submission Deadline

  • Aug 20 2021

    Registration deadline

Sponsored By
IEEE
Tongji University
Chinese Computer Federation
Organized By
Tongji University
Previous Conferences