Introduction

The 8th IEEE International Conference on Applied System Innovation 2022 (IEEE ICASI 2022) will be held in Sun Moon Lake, Nantou, Taiwan on April 21-23, 2022, and it will provide a unified communication platform for researchers in the topics from advanced material science & engineering, information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, design theory, management science, cultural & creative research, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering and other related fields.

Sponsor Type:5; 9; 9

Committee

Honorary General Chairs:

Prof. Shoou-Jinn Chang, National Cheng Kung University

Prof. Yan-Kuin Su, National Cheng Kung University

Prof. Huann-Ming Chou, Vice President of Kun Shan University

Prof. Ji-Hwei Horng, Vice President of National Quemoy University

Prof. Ching-Ting Lee, Vice President of Yuan Ze University

Prof. Yu-Cheng Lin, National Cheng Kung University

Prof. Rong-Fong Fung, Vice President of National Kaohsiung University of Science and Technology

Prof. Chun-Yen Chang, National Taiwan Normal University

Prof. Ming-Chuang Ho, National Yunlin University of Science and Technology

Prof. Jui-Che Tu, National Yunlin University of Science and Technology

Prof. Xing Tong, President of Fujian University of Technology

Prof. Guomai Liu, Vice President of Fujian University of Technology

General Chairs:

Prof. Artde Donald Kin-Tak Lam, Fujian University of Technology

Prof. Liang-Wen Ji, National Formosa University

Prof. Te-Hua Fang, National Kaohsiung University of Science and Technology

Prof. Stephen Prior, The University of Southampton

Prof. Su-Hua Yang, National Kaohsiung University of Science and Technology

Prof. Siu-Tsen Shen, National Formosa University

Prof. Jenn-Kun Kuo, National Sun Yat-Sen University

Prof. Yaw-Shyan Fuh, National University of Tainan

Prof. I-Tseng Tang, National University of Tainan

Prof. Chang-Tzuoh Wu, National Kaohsiung Normal University

Prof. Jun-Dar Hwang, National Chiayi University

Prof. Shi-Chang Tseng, National Yunlin University of Science and Technology

Prof. Heng-Sheng Lin, National Kaohsiung University of Science and Technology

Prof. Cheng-Tang Pan, National Sun Yat-Sen University

General Co-Chairs:

Prof. Sheng-Joue Young, National United University

Prof. Yu-Jen Hsiao, Southern Taiwan University of Science and Technology

Prof. Fu-Cheng Wang, National Taiwan University

Prof. Cheng-Hsing Hsu, National United University

Prof. Hsi-Wen Yang, National United University

Prof. Cheng-Mu Tsai, National Chung Hsing University

Prof. Yeou-Jiunn Chen, Southern Taiwan University of Science and Technology

Prof. Kuang-Chyi Lee, National Formosa University

Prof. Ying-Shieh Kung, Southern Taiwan University of Science and Technology

Prof. Yih-Ran Sheu, Southern Taiwan University of Science and Technology

Prof. Ming-Chih Chen, National Kaohsiung University of Science and Technology

Prof. Chun-Hung Lai, National United University

Prof. Yuh-Ping Chang, Kun Shan University

Prof. Yue Shen, China University of Petroleum

Prof. Kuo-Hsun Wen, Fujian University of Technology

Call for paper

Submission Topics

Topics of interest include, but are not limited to the following:

A. Material Science & Engineering
B. Communication Science & Engineering
C. Computer Science & Information Technology
D. Electrical & Electronic Engineering
E. Mechanical & Automation Engineering
F. Green Technology & Architecture Engineering
G. Internet & IOT Technology
H. Applied Mathematics
I. Management Science
J. Innovation Design & Creative Design
K. Industrial Design & Design Theory
L. Cultural & Creative Research
M. Multimedia Art and Design Foundation (MADF) & Taiwan International Invention and Design Fair (TIIDF)
N. Others

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Important Date
  • Conference Date

    Apr 22

    2022

    to

    Apr 23

    2022

Sponsored By
National United University
IEEE Tainan Section NANO Chapter
Taiwanese Institute of Knowledge Innovation