The Electronics System-lntegration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS -Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.

Call for paper

Important date

Draft paper submission deadline
Final paper submission deadline

Submission Topics

Advanced packaging

Materials for interconnects andpackaging

Optoelectronic systems packaging . Assembly and manufacturing technologies

Design tools and modeling

Power electronics system packaging . Advanced technologies for emergingsystems

Reliability and quality of electronic devi and systems

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Important Date
  • Conference Date

    Sep 13



    Sep 16


  • Mar 31 2022

    Draft paper submission deadline

  • Jun 15 2022

    Final Paper Deadline

Sponsored By
IEEE Electronics Packaging Society
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