The Electronics System-lntegration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS -Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.
Materials for interconnects andpackaging
Optoelectronic systems packaging . Assembly and manufacturing technologies
Design tools and modeling
Power electronics system packaging . Advanced technologies for emergingsystems
Reliability and quality of electronic devi and systems
Draft paper submission deadline
Final Paper Deadline