Presentation Details
Thickness Measurement of Laminated Structure Based on Harmonic Eddy Current Technology
ID：32
View Protection：PUBLIC
Updated Time：2022-12-19 21:05:58
Hits：1010
Poster Presentation
Abstract
Keywords
Speaker
时 涵
电子科技大学All Comments
Important Date
-
Conference Date
Nov 30
2022
toDec 02
2022
-
Nov 30 2022
Draft paper submission deadline
-
Dec 24 2022
Contribution Submission Deadline
-
Apr 13 2023
Registration deadline
Sponsored By
Harbin Insititute of Technology
China Instrument and Control Society
Heilongjiang Instrument and Control Society
Chinese Institute of Electronics
IEEE I&M Society Harbin Chapter
China Instrument and Control Society
Heilongjiang Instrument and Control Society
Chinese Institute of Electronics
IEEE I&M Society Harbin Chapter
Contact Information
- Organizing Committee
- ic******@163.com
Previous Conferences
-
2026-11-13 China Chengdu
2026 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD) -
2026-11-06 China Chengdu
2026 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence -
2025-11-21 China Guangzhou
2025 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence -
2023-11-02 China China
International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence -
2023-11-02 China Xi'an
2023 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence -
2021-10-21 China Nanjing
2021 International Conference on Sensing, Measurement and Data Analytics in the era of Artificial Intelligence -
2020-10-15 China Xi'an
International Conference on Sensing, Measurement and Data Analytics in the era of Artificial Intelligence
Submit Comment