PSMA announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-23), held Feb 1-3, 2023. This Symposium brings synergistic advances in component design and integration combined with 3D manufacturing technologies – customized to different market segments such as computing, automotive industry, energy sector, and low-power medical and wearables systems.

Since the status of the COVID-19 pandemic next February is unforeseen, we have cautiously decided to hold an in-person event, but the recording of all presentations will be available to all paid registrants after the Symposium

Miami is one of Florida’s – and the world’s – most popular vacation spots. Though destinations often are said to offer something for everyone, the Miami area does indeed offer multiple enticements for everyone: The trendy nightlife of South Beach, bejeweled by the eye candy of the Art Deco district. The bustle of Calle Ocho and the highly caffeinated energy of Little Havana. The plush hotels of Miami Beach and the historic hideaways of Coral Gables. Seemingly endless shopping opportunities in modern, sprawling malls and the quiet, personal attention offered by the family-owned shops of Coconut Grove and many other corners of the region.

The great outdoors offers its myriad of fun possibilities. Get out on the water to experience Greater Miami from a different perspective aboard an airboat tour in the Everglades or on a Millionaire’s Row cruise through Biscayne Bay aboard the Island Queen. Or, you can simply rent a paddleboard or kayak and experience the unique aquatic ecosystems up close. FIU’s Modesto Maidique Campus (MMC) is readily accessible from Miami and Fort Lauderdale international airports. Miami International Airport (MIA) is approximately 11 miles from MMC. Fort Lauderdale-Hollywood International Airport (FLL) is approximately 37 miles from MMC.

The technical program continues to build on 2016, 2018, and 2021 Symposia’s success, as 3D-PEIM- again assembles world-class experts representing a far-reaching range of cross-disciplinary perspectives exploring the path to design, development, and manufacturing of future 3D power electronics systems. Created and supported by the PSMA Packaging & Manufacturing Committee, the Symposium encompasses integrated voltage regulators, Multiphysics Design Tools, Additive Manufacturing, Packaging Materials, Embedded Power Modules, Passive Component Integration, and Design for Reliability. In deploying smart power-dense components and modules, sessions will address mechanical, materials, reliability, and manufacturability issues.

Sponsor Type:1; 9



Raj Pulugurtha, Ph.D.
Florida International University


Vanessa Smet
Georgia Institute of Technology

John Bultitude
KEMET Corporation


Brian Narveson, Narveson Consulting, U.S.A – Finance Chair
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chair
Devarajan Balaraman, Wolfspeed, USA – Partner Chair
Sk Yeahia Been Sayeed, USA – Publications Chair
Roman Sosa, Georgia Tech, U.S.A. – Publications Co-Chair
Joe Horzepa, U.S.A. – Executive Director of PSMA
John Horzepa, PSMA, U.S.A – Technical Support
Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chair and Assistant to General Chair
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chair and advisor

2023 Technical Program Committee

Cyril Buttay, Laboratoire Ampère, Lyon
Doug Hopkins, North Carolina State University
Patrick McCluskey, University of Maryland
Brian Narveson,  Narveson Consulting
Jason H. Rouse, Corning
Siddharth Ravichandran, Chipletz
Peter Friedrichs, Infineon
Rajen Murugan, Texas Instruments
Andy Mackie, Indium
Ninand Shahane, Texas Instruments
Shubhendu Bhardwaj, Florida International University
Kay Essig, ASE
G. Q. Lee, Virginia Tech.
Mohamed Jatlaou, Murata
Charlotte Blair,  ANSYS

Call for paper

Important date

Abstract submission deadline
Abstract notification of acceptance
Final paper submission deadline

Submission Topics

The Fourth International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM Welcome – 3D PEIM ( will be held February 1-3, 2023, at Florida International University, Miami, FL, USA.  This symposium is sponsored by the Power Sources and Manufactures Association (PSMA) and will cover synergistic advances in component design and integration combined with 3D manufacturing technologies for power electronics packaging.  Technical Co-Chairman Dr John Bultitude and Venessa Smet invite Industry, Academia, and Government to submit abstracts on the following technologies.

IVR for Computers and Servers      Multiphysics Design & Tools
Additive Manufacturing Manufacturing Technologies
Materials I Interconnects & Lead Attachments  High Power Module Integration
Materials II Substrates & Encapsulants  Passive Component Integration
Thermal Management and Reliability    Low Power & Telemetry


Invited plenary and keynote addresses will be made from Industry and Academic experts. Plenary presentations will be made by Professor Fred C. Lee, Virginia Tech, USA will present on “PCB based Integrated Magnetics” and Professor and Katsuaki Suganuma, University of Osaka, Japan on “Superior heat dissipation by low pressure Ag sinter joining and real time AI lifetime prediction for SiC power module”.

We are also very interested in receiving proposals for presentations from academia, industry and government that describe advances and research in these technologies.  Students are encouraged to submit abstracts on their work in these areas.   Please submit your abstracts from May 23, 2022, via the website link Submission information – 3D PEIM (  Abstracts will be accepted until July 11, 2022, and acceptance notifications will be made by October 10, 2022.  We encourage presenters to publish their work and those that wish to do this will be able to submit papers that will be published by IEEE Explore as proceedings after the conference.

On behalf of the Technical Committee, we look forward to receiving your abstracts that will help us make this another successful 3D-PEIM Symposium. For additional information contact Dr John Bultitude, Technical Program Co-Chair.

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Important Date
  • Conference Date

    Feb 01



    Feb 03


  • Jul 11 2022

    Abstract Submission Deadline

  • Oct 10 2022

    Abstract Notification of Acceptance

  • Dec 12 2022

    Final Paper Deadline

Sponsored By
IEEE Electronics Packaging Society
Power Sources Manufacturers Association