Introduction

ANNOUNCEMENT

It is our pleasure to make the second announcement for the 17th International Conference on Intergranular and Interphase Boundaries in Materials (IIB 2023), to be held in Beijing, China, from June 26th to 30th, 2023. Please notice that the date has shifted one week earlier than that previously planned, to avoid time conflict with other important conferences.

We hope that the COVID-19 pandemic and related travel restrictions will be behind us at some point in 2022 and that there will be clean and free air all over the world by the time of the meeting in 2023. We look forward to seeing you in Beijing, China.

GOAL AND AUDIENCE

The important role of interfaces in determining the properties of materials, and in microstructural evolution during manufacture and in-service operation, is increasingly appreciated by a wide range of researchers in different fields as a consequence of advances in theory, instrumentation, software and computational resources allowing investigation of interfaces at the atomic scale.

IIB conferences provide a platform for scientists and researchers to exchange ideas regarding the understanding, control, and design of interfaces in various materials and to share new advances in their research in different fields of interface science and technologies.

Committee

International Scientific Committee:

Sergiy V. Divinsky Germany
Olivier Hardouin Duparc France
Yuichi Ikuhara Japan
Wayne D. Kaplan Israel
Masanori Kohyama Japan
Philomela Komninou Greece
Sylvie Lartigue-Korinek France
Douglas L. Medlin USA
Dmitri A. Molodov Germany
Frédéric Mompiou France
Andriy Ostapovets Czech
Eugen Rabkin Israel
Gregory Rohrer USA
David Seidman USA
David J. Srolovitz USA
Boris B. Straumal Russia
Rong Yu China
Thomas Walther UK
Wenzheng Zhang

China

 

Organizing Committee:

Co-Chairs: Secretaries:
Wenzheng Zhang Junjie Guo
Rong Yu Xinfu Gu

 

Local Scientific Committee:

Chair: Secretary:
Xiaodong Han Lihua Wang

 

Members:  
Jianghua Chen Yong Jiang
Kui Du Hui Gu
Xinfu Gu Junjie Guo
Xiuliang Ma Manling Sui
Weiguo Wang Qian Yu
Rong Yu Zhiyang Yu
Wenqing Zhang Wenzheng Zhang
Call for paper

Important date

2023-01-31
Abstract submission deadline
2023-02-28
Abstract notification of acceptance

IIB2023 welcomes papers covering various intergranular and interphase boundaries in materials. IIB 2023 will be a one-session conference based on invited lectures, oral presentations, extended discussion periods, and poster sessions (posters will be exposed during entire duration of the conference).

Abstracts and presentations are in English. When you prepare an abstract to IIB2023, please use the provided template. Please use full first name and last name of all author, and underline the name of the presenting author. To avoid possible format change, it is suggested to submit your abstract in PDF form. Please indicate with the keywords on the materials, main methods, e.g., electron microscopy or simulation, so that Conference Secretariat can send your abstract to an appropriate reviewer.

Submission Topics

COVERAGE

IIB conferences strongly promote an interdisciplinary approach in the field of structures and properties of grain boundaries and interphase boundaries in a wide range of materials. A variety of hot topics will include but not limited to:

  • Characterization of interfaces
  • Modeling of interfaces
  • Thermodynamics and kinetics of interfaces
  • Properties of interfaces
  • Interfaces in metals, ceramics, composites, and organic materials
  • Interfaces in electronic, magnetic, and energy materials
  • Interfaces in biomaterials, nanomaterials, and emerging materials
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Important Date
  • Conference Date

    Jun 26

    2023

    to

    Jun 30

    2023

  • Jan 31 2023

    Abstract Submission Deadline

  • Feb 28 2023

    Abstract Notification of Acceptance

Supported By
Tsinghua University
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