2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

AboutComponents, Circuits, Devices and Systems; Computing and Processing; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems; Signal Processing and Analysis
Keywords:Microelectronics,Components, packaging, and manufacturing technology,Artificial intelligence,Soldering,Chip scale packaging,heterogeneous integration,
Scope:micro-nanoelectronics, materials, designs, reliability, simulation, thermal and thermomechanical behaviour, multiphysics, heterogeneous integration
Sponsor Type:1; 9