AboutComponents, Circuits, Devices and Systems; Computing and Processing; Engineering Profession; Fields, Waves and Electromagnetics; General Topics for Engineers; Power, Energy and Industry Applications
Keywords:Chip/package Co-design,Device,System performance,Signal integrity,Printed Circuit,Circuits and Systems,Voltage regulators,Device modeling,Hetrogenous integration,Power integration,Power integrity ,Machine learning,Education ,Microelectronics,Thermal Solution,Electronics cooling,Automobile Electronics,Emerging Memory Technologies,Memory Circuits,Electromagnetic Packaging,Device Physics,Compact Modeling,Flexible Electronics ,EDA Tools,
Scope:DTMES is established with an intention of creating and boosting research in the areas of design of devices, circuits, systems and packaging in Ethiopia and rest of Africa. Despite the huge potential of the region, there has been very few annual IEEE activities in the region. In the past two decades, the region has produced numerous numbers of Electrical and Computer Engineering graduates that have been introduced into the system following the expansion of existing universities across the continent. Unfortunately, these engineers do not have access to the worldwide pool of engineers and companies, while at the same time the international community cannot benefit from their considerable potential. DTMES is determined to close this gap by providing the much-needed bridging between the two. Thus, DTMES will serve as the flagship event in the region and in Africa. DTMES also aims to become a meaningful backup to the region’s digital technology assisted economic growth strategy.
Sponsor Type:1
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Important Date
  • Conference Date

    Feb 06



    Feb 08


Sponsored By
IEEE Electronics Packaging Society