EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

Sponsor Type:1; 1; 1

Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
2023-07-14 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification

Submission Topics

System-level, board-level, package-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design
Signal and thermal integrity
Power integrity and power distribution networks
Low power mobile and personal applications
Memory and DDR interfaces
Jitter and noise management
Electronic packages and microsystems
Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
Measurement and data analysis techniques for system‐level and on‐chip structures
High volume testing for electronic packages.

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Important Date
  • Conference Date

    Oct 15



    Oct 18


  • Jul 14 2023

    Draft paper submission deadline

  • Oct 18 2023

    Registration deadline

Sponsored By
IEEE Antennas and Propagation Society
IEEE Electronics Packaging Society
IEEE Microwave Theory and Technology Society