Introduction

IEEE COMCAS 2023 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications and sensors, antennas, propagation and scattering, RF/MW devices and circuits, RFICs, signal processing and imaging, microwave systems, radar, acoustics, bio-medical engineering, automotive radar and communications, electronic packaging and thermal management. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.

Sponsor Type:1; 1; 1; 1; 2; 3; 5; 5; 9

Committee

Conference Chair:

Shmuel Auster
Chair, IEEE Israel Section

Treasurer:

Robert C. Shapiro
IEEE R5 Past Director
IEEE COMSOC Past Treasurer

Local Arrangements Chair:

Idit Schaffer
AEAI, Israel

Social Functions and Hospitality:

Meira Auster
Alona Boag

Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
2023-04-18 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification

Submission Topics

Communications and Sensors

Antennas, Propagation, and Scattering

Electronic Packaging & Thermal Management

Biomedical Engineering

RF/MW Circuits and Devices

Microwave Systems, Radar, Acoustics

Signal Processing and Imaging 

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Important Date
  • Conference Date

    Nov 06

    2023

    to

    Nov 08

    2023

  • Apr 18 2023

    Draft paper submission deadline

  • Nov 08 2023

    Registration deadline

Sponsored By
IEEE Aerospace and Electronic Systems Society
IEEE Antennas and Propagation Society
IEEE Electronics Packaging Society
IEEE Microwave Theory and Technology Society
Israel Association of Engineers
IEEE Israel Section
Region 08 - Europe,Middle East,Africa