Introduction
IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Call for paper
Important date
2023-03-05
Draft paper submission deadline
2023-04-21
Draft paper acceptance notification
2023-05-05
Final paper submission deadline
IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Submission Topics
- Organic/Inorganic Electronics and Sensors
- Advanced Manufacturing Techniques
- Hybrid Flexible Sensors and Electronics
- Soft/Smart Wearable and Implantable Sensing Systems
- Printed Large-Area Sensors and Systems
- Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
- Flexible/Printable Electronics in context with Circular and Green Electronics
- Emerging Materials for Flexible and Printable Systems
- High-throughput Printable Electronics
- Stretchable/Shrinkable Sensors and Electronics
- Disposable/Reusable Sensors and Electronics
- Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Reliability, Simulation and Modelling
All Comments
Important Date
-
Conference Date
Jul 09
2023
toJul 12
2023
-
Mar 05 2023
Draft paper submission deadline
-
Apr 21 2023
Draft Paper Acceptance Notification
-
May 05 2023
Final Paper Deadline
Sponsored By
IEEE Sensors Council
Contact Information
- Miss Claire Folkerts
- cf******@conferencecatalysts.com
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