AboutComponents, Circuits, Devices and Systems; Computing and Processing; Photonics and Electrooptics; Signal Processing and Analysis
Keywords:Failure Analysis,Integrated Circuits,Electrostatic Discharge (ESD),Interconnect ,Field Programmable Gate Array (FPGA),Packaging Reliability,High Power Electronics,Nonvolatile Memory,Very Large Scale Integrated Circuitry
Scope:IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved know how of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nano-devices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments.
Sponsor Type:1; 5; 5; 9
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  • Conference Date

    Jul 23



    Jul 26


Sponsored By
Collaborative Microelectronic Design Excellence Center Universiti Sains Malaysia IEEE Electron Devices Society Malaysia Section, ED/MTT/SSC Penang Chapter Singapore Section R/EP/ED Jt Chapter
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