AboutAerospace; Bioengineering; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; Fields, Waves and Electromagnetics; General Topics for Engineers; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems; Signal Processing and Analysis; Transportation
Keywords:Advanced Packaging & Processes,Automotive Systems & Hardware,Cleaning Technologies,Heterogeneous Integration,Inspection & Test Techniques,Interposer & Packaging Technology,Materials & Reliability,Nanotechnology Applications,Trends, Roadmaps,
Scope:The Pan Pacific Microelectronics Symposium strives to build bridges and nurture relationships across all boundaries; oceans and cultures, industries and technologies, companies and individuals. Its location in Hawaii always provides the requisite isolation from day to day distractions necessary to support these goals and enhance personal face to face interactions.
Sponsor Type:1; 9
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Important Date
  • Conference Date

    Jan 29



    Feb 01


Sponsored By
IEEE Electronics Packaging Society Surface Mount Technology Association (SMTA)