Introduction
The International Conference on Microwave Acoustics & Mechanics (IC-MAM) represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes as well as components and devices, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems based on RF-MEMS and Acoustics. IC-MAM is organized by the IEEE Microwave Theory and Technology Society (MTT-S). The conference features an exciting technical program and invited talks by worldwide recognized experts of RF-MEMS and BAW/SAW technologies.
Sponsor Type:1
Committee
Conference General Chair:
chairs.icmam@mtt.org
Ken-ya Hashimoto
University of Electronic Science and Technology of China, China
Technical Program Chair:
tpc.icmam@mtt.org
Shuji Tanaka
Tohoku University, Japan
Amelie Hagelauer
Technical University of Munich, Munich, Germany
Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT, Munich, Germany
Conference Finance Chair:
finance.icmam@mtt.org
Jingfu Bao
University of Electronic Science and Technology of China, China
Holger Maune
Otto-von-Guericke-Universität Magdeburg, Germany
Exhibition Chair:
Gongbin Tang
Shandong University, China
Publications Chair:
publications.icmam@mtt.org
Qiaozhen Zhang
Shanghai Normal University, China
Local Arrangement Chair:
Cheng Tu
University of Electronic Science and Technology of China, China
Li Ting
University of Electronic Science and Technology of China, China
Operational Officer:
Leonie Sallinger
Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT, Munich, Germany
Call for paper
Important date
The International Conference on Microwave Acoustics & Mechanics (IC-MAM) represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes as well as components and devices, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems based on RF-MEMS and Acoustics. IC-MAM is organized by the IEEE Microwave Theory and Technology Society (MTT-S) and features an exciting technical program and invited talks by worldwide recognized experts of RF-MEMS and BAW/SAW technologies.
Submission Topics
Conference Topics
Perspective authors are cordially invited to submit papers in all areas of Microwave Acoustics and RF MEMS including but not limited to:
- Acoustic/MEMS Device Applications
- Acoustic/MEMS Device Design
- Acoustic/MEMS Device Modeling
- Materials & Propagation
- Advances in Filter and Multiplexer Technology
- SAW and BAW Sensor Devices and Applications
- Multi-Band RF Modules for Multi-Standard/-Mode Systems
- Fusion of Major Transmit and Receive Functionality in Single Modules
- Tunable & Reconfigurable Devices, like Bulk and Thin-film Components and Devices, e.g., based on Ferroelectrics, Phase-Change Materials
Guidlines
Submitted papers should be 3 to 4 pages in length. Authors must adhere to the format of the IEEE conference paper template
Important Dates
| Submission deadline: | February 18, 2024 |
| Notification of Acceptance: | May 16, 2024 |
| Final Paper Submission: | April 13, 2024 |
| Conference Date: | May 18–20, 2024 |
All Comments
Important Date
-
Conference Date
May 13
2024
toMay 15
2024
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Feb 18 2024
Draft paper submission deadline
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Mar 16 2024
Draft Paper Acceptance Notification
-
Apr 13 2024
Final Paper Deadline
Sponsored By
Contact Information
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