About Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics
Keywords:Reconfigurable Radio & Wireless Connectivity,Systems and Circuits,Low Power Transceiver ICs,Receiver Sub-Systems and Circuits,Reconfigurable and Tunable Front-Eng ICs,Transmitter Sub-Systems and Power Amplifiers,Millimeter-and Sub-Millimeter Wave Systems ICs,,
Scope:RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Sponsor Type:1; 1; 1


General Chair
Donald Y.C. Lie, Texas Tech. Univ.

Technical Program Chair/Co-Chair
Danilo Manstretta, Univ. of Pavia
Hua Wang, ETH Zurich

Student Chair
Francois Rivet, Univ. of Bordeaux

Industry Chair
Debopriyo Chowdhury, Broadcom Corp.

Publications Chair/Co-Chair
Steven Turner, BAE Systems
Jennifer Kitchen, Arizona State Univ.

Systems & Applications Forum Chair
Gernot Hueber, Silicon Austria Labs

Transactions JSSC Guest Editor
Hossein Hashemi, Univ. of Southern California

Transactions TMTT Guest Editor
Jane Gu, Univ. of California, Davis

Workshops Chair/Co-Chair
Bodhisatwa Sadhu, IBM Research
Amin Arbabian, Stanford Univ.

Panel Sessions Chair
Oren Eliezer, Ambiq

Publicity Chair
Mona Hella, Rensselaer Polytechnic Inst.

Asia Pacific Liaison
Kenichi Okada, Tokyo Inst. of Tech.

European Liaison
Yao-Honh Liu, IMEC

Margaret Szymanowski, Crane Aerospace & Electronics

Session Organization Chair
Joseph Cali, Raytheon Technologies

Visa Letters
Zaher Bardai, IMN Epiphany

Website Chair
Michael Oakley, Raytheon Technologies

Call for paper
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Important Date
  • Conference Date

    Jun 15



    Jun 17


  • Jun 17 2025

    Registration deadline

Sponsored By
IEEE Electron Devices Society
IEEE Microwave Theory and Technology Society
IEEE Solid-State Circuits Society