Introduction

EOS/ESD Association, Inc. is sponsoring the 2024 International EOS/ESD Symposium on Design and System (IEDS). IEDS 2024 is dedicated to the fundamental understanding of issues related to ESD on design and system and the application of this knowledge to the solution of problems. The TPC solicits Symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing.

Committee

Conference Advisory Chair

Hanming Wu, Zhejiang University

Ming-Dou Ker, National Yang Ming Chiao Tung University

Conference Chair

Emeritus Junjun Li, ESDA

Shurong Dong, Zhejiang University

Conference Chair

Rui Zhang, Zhejiang University

Conference Co-Chair

Shih-Hung Chen, IMEC

Technical Program Chair

Chun-Yu Lin, National Taiwan Normal University

Technical Program Co-Chair

Jie Zeng, GLOBALFOUNDRIES

Workshop Chair

Guangyi Lu, HiSilicon

Local Arrangement Chair

Qiang Cui, Zhejiang University

Publicity Chair(s)

Bernard Chin, Qorvo

Xiaozong Huang, CETC-24

Xiangliang Jin, Hunan Normal University

Huijuan Wang, Honor

Yafei Yuan, BOIMT

Sen Zhang, CSMC

Yulong Zhu, Hanwa

Conference Event Manager

Christina Earl, ESDA Business Operations Manager

Conference Technical Advisor

Nathaniel Peachey, Qorvo, ESDA Senior Vice President

Conference Program Advisor

Lisa Pimpinella, ESDA Executive Director

Call for paper

Important date

2023-10-20
Draft paper submission deadline

EOS/ESD Association, Inc. is sponsoring the 3rd International EOS/ESD Symposium on Design and System (IEDS). IEDS 2024 is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems. The Technical Program Committee solicits symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing. The Technical Program Committee is inviting papers related, but not limited, to the following tracks:

Advanced CMOS EOS/ESD and Latch-up

ESD protection in Bipolar, RF, High-voltage, and BCD technologies

ESD modeling, simulation and design automation

EOS/ESD Failure analysis and case studies

ESD and Latch-up testing

System ESD design and troubleshooting issues

ESD manufacturing control issues and target discussion

Device, circuit and product reliability

Guidlines

Authors must submit a maximum 50-word abstract and maximum 4-page summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the technical area related to their submission. Abstract submissions can be made electronically at: https://softconf.com/n/eos-esd2024

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Important Date
  • Conference Date

    May 08

    2024

    to

    May 10

    2024

  • Oct 20 2023

    Draft paper submission deadline

Sponsored By
Electrostatic Discharge Association - EOS/ESD Association IEEE Electromagnetic Compatibility Society IEEE Electron Devices Society IEEE Reliability Society