Introduction

The 30th THERMINIC Workshop will be held in Toulouse, France. THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. For aca- demics and industrialists involved in micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events. We invite delegates to consider submitting abstracts that are related, but not limited to, the following topics:

Thermal Phenomena in Simulation & Experiment:

  • Thermal management of electronic components and systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials and their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer
  • Use of novel, advanced mathematics and statistics concepts / AI methods for complex digital twins of components and systems

Electronics Cooling Concepts & Applications:

  • Cooling concepts: air, liquid, 2-phase, etc. • Power electronics
  • High temperature electronics
  • Solid state lighting LED packages and LED based lighting solutions
  • Thermo-electric and sub-ambient cooling
  • Novel and advanced cooling technologies
  • Heat pipe and vapor chambers
  • 3D heterogenous integration and cooling, ultra low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Battery thermal management

Thermo-Mechanical Reliability

  • Thermo-mechanical reliability
  • Prognostics and health monitoring
  • Lifetime modelling and prediction
  • Damage and fracture mechanics
  • Failure analysis and inline inspection

Work targeting aeronautics and space will be particularly appreciated.

Call for paper

Important date

2024-04-06
Draft paper submission deadline
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Important Date
  • Conference Date

    Sep 25

    2024

    to

    Sep 27

    2024

  • Apr 06 2024

    Draft paper submission deadline

Sponsored By
IEEE Electronics Packaging Society Laboratoire d'Analyse et d'Architecture des Systemes - LAAS