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Copper metallization on oxide ceramics by low pressure cold spray and its deposition mechanism analyses
ID：78 View Protection：ATTENDEE Updated Time：2024-10-14 11:14:46 Hits：3021 Plenary Presentation

Start Time：2024-10-19 09:20（Asia/Shanghai）

Duration：30min

Session：P International Conference on Surface Engineering » P1Plenary/Opening Session

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Abstract
Copper Metallization on Oxide Ceramics by Low Pressure Cold Spray and Its Deposition Mechanism Analyses
Keywords
Speaker
Kazuhiko Ogawa
Tohoku University, Japan

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Important Date

  • Conference Date

    Oct 18

    2024

    to

    Oct 20

    2024

  • Oct 17 2024

    Contribution Submission Deadline

  • Oct 20 2024

    Registration deadline

  • Nov 18 2024

    Draft paper submission deadline

Sponsored By
Chinese Mechanical Engineering Society – Surface Engineering Institution (CMES)
Organized By
Dalian University of Technology (DUT)
Shandong University of Technology (SDUT)
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