Introduction

Sponsored by IEEE and ACM, and jointly organized by EDA² and the EDA Committee of CIE, the ISEDA (International Symposium of EDA) is an annual premier forum dedicated to VLSI design automation. The symposium aims at exploring the new challenges, presenting leading-edge technologies and providing EDA community with opportunities of predicting future directions in EDA research areas. ISEDA covers the full range of EDA topics from device and circuit levels up to system level, from analog to digital designs as well as manufacturing. The format of meeting intends to cultivate productive and novel interchangeable ideas among EDA researcher and developers. Academic and industrial EDA related professionals who are interested in EDA's theoretical and practical research are all welcomed to contribute to ISEDA.

Call for paper

Important date

2024-02-10
Draft paper submission deadline

[1] TECHNOLOGY & MODEL

 Chair: Xingsheng Wang

 Co-Chair: Lining Zhang

  • 1.1 Device Compact Modeling

  • 1.2 Process Design Kit

  • 1.3 Semiconductor Process & Device Simulation

  • 1.4 Cell Library Design, Characterization and Verification

[2] ANALOG CIRCUIT

 Chair: Fan Yang (FDU)

 Co-Chair: Hao Yu

  • 2.1 Schematic & Layout Design

  • 2.2 Circuit Simulation

  • 2.3 On-chip & Packaging Electromagnetic Field Simulation

  • 2.4 Radio-Frequency & Photoelectric Compound Circuit Simulation

[3] DIGITAL DESIGN & VERIFICATION

 Chair: Zhufei Chu

 Co-Chair: Yong Fu

  • 3.1 Digital Simulation / Emulation

  • 3.2 High-Level Synthesis

  • 3.3 Logic Synthesis

  • 3.4 Formal Verification

  • 3.5 Constructing Hardware in Scala Embedded Language

[4] PHYSICAL IMPLEMENTATION

 Chair: Hailong Yao

 Co-Chair: Peng Cao

  • 4.1 Design-For-Test, Design-For-Reliability, Design-For-Manufacturability

  • 4.2 Placement & Routing

  • 4.3 Parasitic Extraction

  • 4.4 Timing Analysis

  • 4.5 Physical Verification

  • 4.6 Electromigration & IR drop

[5] WAFER MANUFACTURING

 Chair: Lan Chen

 Co-Chair: Yayi Wei

  • 5.1 Computational Lithography

  • 5.2 Masking Manufacturing

  • 5.3 Yield & Defect Analysis

  • 5.4 Process Modeling and Emulation

  • 5.5 Metrology and Silicon Data Processing

  • 5.6 APC (Automatic Process Control) Technology

[6] PACKAGING & MULTI-PHYSICS

 Chair: Hongliang Lu

 Co-Chair: Min Tang

  • 6.1 Packaging Design

  • 6.2 Chip Level Thermal Simulation

  • 6.3 Packaging Stress Analysis

  • 6.4 Multi-Physics Simulation

[7] EMERGING TECHNOLOGIES

 Chair: Bei Yu

 Co-Chair: Li Jiang

  • 7.1 Artificial Intelligence for EDA

  • 7.2 Cloud / Parallel Computing for EDA

  • 7.3 Heterogeneous Computing for EDA

[8] MISCELLANEOUS

 Chairs: Xiaohui Tan, Huawei Li, Longxing Shi

 Co-Chairs: Duanduan Jian, Guojie Luo, Zhixiong Di

  • 8.1 Open Source EDA

  • 8.2 EDA Database

  • 8.3 EDA Standardization

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Important Date
  • Conference Date

    May 10

    2024

    to

    May 13

    2024

  • Feb 10 2024

    Draft paper submission deadline

Sponsored By
IEEE Council on Electronic Design Automation
Xidian University