Introduction

ECIE 2024 will be held from 24 to 26, May 2024 in Hangzhou, China. ECIE 2024 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of electronics, circuits, and information engineering. Conference topics mainly include but are not limited to software engineering, power and energy circuits, optoelectronics, single-chip microcomputer technology, etc. ECIE 2024 welcomes all high-quality research papers and presentations from related research fields. 

Internet of Things Planned highlights of ECIE 2024 include: 

● Addresses and presentations by some of the most respected researchers in the electronics, circuits, and information engineering

● Panel discussions

● Presentations of accepted academic and practitioner research papers; a poster paper session

Committee
Conference General Chair
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Xiaoniu Yang

 

Academician of Chinese Academy of Engineering, National Key Laboratory of Electromagnetic Space Security, China

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Qinyu Zhang

 

Harbin Institute of Technology (Shenzhen), China

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Jiming Chen (IEEE Fellow)

 

Zhejiang University of Technology, China

Technical Program Committee Chair
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Xianbin Wang (IEEE Fellow)

 

Western University, Canada

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Haijun Zhang (IEEE Fellow)

 

University of Science and Technology Beijing, China

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Weidang Lu (IEEE Senior Member)

 

Zhejiang University of Technology, China

Publication Chair
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Yu Zhang

 

Zhejiang University of Technology, China

Local Organizing Chair
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Nan Zhao (IEEE Senior Member)

 

Dalian University Of Technology, China

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Bo Li (IEEE Member)

 

Harbin Institute of Technology (Weihai), China

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Guoxing Huang

 

Zhejiang University of Technology, China

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Yuxin Xu

 

Zhejiang University of Technology, China

 

Committee Members

Mingqian Liu, IEEE Senior Member, Xidian University, China

Yueling Che, Shenzhen University, China

Xiulan Song, Zhejiang University of Technology, China

Jianhua Tang, South China University of Technology, China

Huimei Han, Zhejiang University of Technology, China

Pham The Bao, Sai Gon University, Viet Nam

Valentina E. Balas, Aurel Vlaicu University of Arad, Romania

Seifedine Kadry, Noroff University College, Norway

 

Technical Program Committees

Jie Tang, IEEE Senior Member, South China University of Technology, China

Zhutian Yang, IEEE Member, Harbin Institute of Technology, China

Shaohua Wu, IEEE Member, Harbin Institute of Technology (Shenzhen), China

Tiankui Zhang, IEEE Member, Beijing University of Posts and Telecommunications, China

Jinbei Zhang, Sun Yat-sen University, China

Yunqi Feng, Zhejiang University of Technology, China

Qingqing Zhang, IEEE Member, Zhejiang University of Technology, China

Call for paper

Important date

2024-03-10
Draft paper submission deadline

2024 4th International Conference on Electronics, Circuits and Information Engineering (ECIE 2024)  will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

The topics of interest for submission include, but are not limited to:

 

  • Antenna Systems, propagation, and RF design

  • Electric vehicles, vehicular electronics and intelligent transportation

  • Emerging technologies, 5G and beyond

  • IoV, IoT, M2M, sensor networks, and Ad-Hoc networking

  • Machine learning and optimization for wireless systems

  • Positioning, navigation, and mobile satellite systems

  • Radio access technology and heterogeneous networks

  • Spectrum management for communications

  • Reconfigurable intelligent surfaces and smart environments

  • Unmanned aerial vehicle communications, vehicular networks, and telematics

  • Wireless networks: protocols, security and services

  • Cognitive radio and AI-enabled networks

  • Communication and information system security

  • Communications QOS, reliability and modelling

  • Commumications software

  • Physical layer and communication theory

  • Green communications

  • Transmission and reception techniques

  • Mobile  networks

  • Next-generation networking and internet

  • Optical networks and systems

  • Signal processing for communications

  • E-mobility and E-vehicles, power technologies and integration in smart grids

  • Wired networks

  • Space-air-ground communication and space networking 

  • Multimedia communications

  • Integrated sensing and communication

  • Semantic communications

  • Cloud and edge computing

  • Source and channel encoding

  • Information and communications engineering

  • Digital circuits and signal processing

  • Analog circuit and signal processing

  • VLSI design and fabrication

  • Semiconductor devices and circuits

  • Parallel and distributed computing

  • Measurement and control technology and instrument

  • Test and reliability

  • Sensing and sensor networks

  • Single-chip microcomputer technology

  • Low power consumption and acquisition technology

  • Electromagnetic compatibility

  • Electrotechnics

  • Electric machine and electric appliances

  • Power and energy circuits

  • Power system communication

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Important Date
  • Conference Date

    May 24

    2024

    to

    May 26

    2024

  • Mar 10 2024

    Draft paper submission deadline

Sponsored By
Nanjing Section
Zhejiang University of Technology