Introduction

2024 IEEE 14th International Symposium on Industrial Embedded Systems (SIES 2024) will be held from 23 to 25 October in Chengdu, China. SIES 2024 is co-sponsored by IEEE and University of Electronic Science and Technology of China, China.

The SIES series was hosted by University of Nice Sophia Antipolis, France (2006); Uninova, Portugal (2007); LIRMM/CNRS, France (2008); Ecole Polytechnique Fédérale de Lausanne, Switzerland (2009); University of Trento, Italy (2010); Mälardalen University, Sweden (2011); Karlsruhe Institute of Technology, Germany (2012); Polytechnic Institute of Porto, Portugal (2013); Scuola Superiore S. Anna, Italy (2014); Siegen University, Germany (2015); AGH UST, Poland (2016), and France (2017), Graz University of Technology, Austria (2018).

The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems and their applications in a variety of industrial environments.

Committee

General Chairs

   
Wei Jiang University of Electronic Science and Technology of China  China
Haibo Zeng Virginia Tech  USA

Technical Program Committee Chairs

 
Daniel Casini Scuola Superiore Sant'Anna - Pisa  Italy
Qingxu Deng Northeastern University  China
Zhishan Guo NC State University  USA

SIES Series Steering Committee

   
R. Ernst Technische Universität Braunschweig  Germany
G. De Micheli École Polytechnique Fédérale de Lausanne Switzerland
R. Gupta University of California San Diego USA
A. S.-Vincentelli University of California, Berkeley USA
R. Zurawski ISA Group USA

International Advisory Committee

 
J. J. Chen Technical University of Dortmund Germany
E. Dekneuvel UNSA France
L. Gomes Uninova Portugal
T. Nolte Mälardalen University Sweden
R. Obermaisser University of Siegen Germany
R. Passerone University of Trento Italy
G. Sassatelli LIRM France
E. Tovar IPP Portugal
A. Vachoux EPFL Switzerland
K. Zielinski AGH UST Poland
J.-L. Scharbarg INP-ENSEEIHT & IRIT France

Treasurer

   
Tina Wang CZES  China

Local Chairs

   
Jinyu Zhan University of Electronic Science and Technology of China  China
Wenzheng Xu Sichuan University  China
Maolin Yang University of Electronic Science and Technology of China  China

Publicity Chairs

   
Miguel Gutierrez Gaitan Pontificia Universidad Católica de Chile  Chile
Catherine Nemitz Davidson College  USA
Yehan Ma Shanghai Jiao Tong University  China

Publication Chair

   
Xiaotian Dai University of York  UK

Publication Co-Chair

   
Jing Liu CZES China

 

Call for paper

Topics are interested but not limited to:

 

EMBEDDED SYSTEMS

  • Design and Validation of Embedded Systems
  • Real-Time Systems
  • Real-Time Artificial Intelligence and Machine Learning
  • Models of Embedded Computation
  • Design and Verification Languages
  • Operating Systems and Scheduling
  • Timing and Performance Analysis
  • Design Space Exploration
  • Virtualization Technologies
  • QoS Mechanisms for Virtualization
  • Energy and Power Aware Embedded Computing
  • Fault Tolerance & Dependability Adaptive Embedded Systems
  • Cyber-Security for Embedded Systems

SYSTEM-ON-CHIP AND NETWORK-ON-CHIP DESIGN & TESTING

  • Design of Application-Specific Instruction-Set Processors
  • Design and Programming of Embedded Multiprocessors
  • SoC Communication and Architectures
  • RISC-V and Open Hardware
  • NoC Communication and Architectures
  • Design of SoC/NoC
  • Platform-Based Design for Embedded Systems
  • Reconfigurable Platforms
  • Multiprocessor SoC Platforms and Tools
  • Testing of Embedded Core-based Integrated Circuits
  • Hardware Security

NETWORKED EMBEDDED SYSTEMS AND EDGE COMPUTING

  • Design Issues for Networked Embedded
  • Middleware Frameworks
  • AI at the edge
  • Resource Scheduling and Orchestration in Distributed Systems
  • Self Adaptive Networked Entity Sensor Networks
  • Time-Sensitive Networks and 5G/6G-enabled Embedded Systems
  • End-to-End Latency Guarantees in the Edge-to-Cloud Continuum
  • Methodologies for Performance-Aware Functional Decomposition between Cloud and Edge
  • Safety, Security, and Real-Time Performance in Distributed Applications

  •  

EMBEDDED APPLICATIONS

  • Cyber-physical systems and Internet of Things, including Industrial Automation and Controls
  • Automotive Applications and Autonomous Driving
  • Intelligent Transportation Systems
  • Smart Home
  • Wireless Health Care
  • Industrial Building Automation and Control
  • Real-Time Edge Computing Use Cases
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Important Date
  • Conference Date

    Oct 23

    2024

    to

    Oct 25

    2024

Sponsored By
IEEE Council on Electronic Design Automation
University of Electronic Science and Technology of China