This symposium pictures the future state of the electronics packaging which impacts the infrastructures of 5G and B5G. The symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging for Advanced Heterogeneous Integration.

Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
2024-05-31 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification
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Important Date
  • Conference Date

    Nov 13



    Nov 15


  • May 31 2024

    Draft paper submission deadline

  • Nov 15 2024

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society
Tokyo/FK/HR/NG/SP/SN/SE/SK Jt Sec EP Chapter
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