Introduction

This symposium pictures the future state of the electronics packaging which impacts the infrastructures of 5G and B5G. The symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging for Advanced Heterogeneous Integration.

Call for paper

Important date

2024-05-31
Draft paper submission deadline
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Important Date

  • Conference Date

    Nov 13

    2024

    to

    Nov 15

    2024

  • May 31 2024

    Draft paper submission deadline

  • Nov 15 2024

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society
Tokyo/FK/HR/NG/SP/SN/SE/SK Jt Sec EP Chapter
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